FW300R1 Lineage Power, FW300R1 Datasheet - Page 14

• Manufacturer Part Number: FW300R1
• Description: CONVERTER DC/DC 28V 300W OUT
• Manufacturer: Lineage Power
• Series: FW300r
• Type: Isolated with Remote On/Offr

Specifications of FW300R1

• Output: 28V
• Number Of Outputs: 1
• Power (watts): 300W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: Module
• 1st Output: 28 VDC @ 10.7A
• Size / Dimension: 4.60" L x 2.40" W x 0.53" H (116.8mm x 61mm x 13.5mm)
• Power (watts) - Rated: 300W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 90.5%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

FW250R1 and FW300R1 Power Modules: dc-dc Converters:
36 Vdc to 75 Vdc Input, 28 Vdc Output; 250 W to 300 W
Thermal Considerations
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb.). For the screw
attachment from the pin side, the recommended hole
size on the customer’s PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total mod-
ule thermal resistance ( ca) is defined as the maximum
case temperature rise ( T
power dissipation (P
The location to measure case temperature (T
shown in Figure 18. Case-to-ambient thermal resis-
tance vs. airflow for various heat sink configurations is
shown in Figures 21 and 22. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
Figure 21. Case-to-Ambient Thermal Resistance
14
14
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
ca
0
=
Curves; Transverse Orientation
-------------------- -
(100)
0.5
T
P
C max
,
D
AIR VELOCITY, m/s (ft./min.)
D
(200)
1.0
):
=
C, max
----------------------- -
T
(300)
C
1.5
P
–
) divided by the module
D
T
A
(continued)
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
(400)
2.0
(500)
2.5
C
) is
8-1321 (C)
(600)
3.0
Figure 22. Case-to-Ambient Thermal Resistance
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 21 and
22 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance.
To choose a heat sink, determine the power dissipated
as heat by the unit for the particular application.
Figure 23 shows typical heat dissipation for a range of
output currents and three voltages for the FW250R1.
Figure 23. FW250R1 Power Dissipation vs. Output
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
0
0
Curves; Longitudinal Orientation
Current at 25 °C
(100)
1
0.5
V
I
= 75 V
2
AIR VELOCITY, m/s (ft./min.)
(200)
1.0
OUTPUT CURRENT, I
3
V
4
(300)
I
1.5
= 54 V
Tyco Electronics Corp..
5
V
1 1/2 IN. HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
I
(400)
O
= 36 V
2.0
(A)
6
March 2000
Data Sheet
7
(500)
2.5
8
8-1320 (C)
8-1723 (C)
(600)
3.0
9