QW050A1 Lineage Power, QW050A1 Datasheet - Page 14

• Manufacturer Part Number: QW050A1
• Description: CONVERTER DC/DC 5V 50W OUT
• Manufacturer: Lineage Power
• Series: QWr
• Type: Isolated with Remote On/Offr

Specifications of QW050A1

• Output: 5V
• Number Of Outputs: 1
• Power (watts): 50W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 8-DIP Module
• 1st Output: 5 VDC @ 10A
• Size / Dimension: 2.28" L x 1.45" W x 0.50" H (57.9mm x 36.8mm x 12.7mm)
• Power (watts) - Rated: 50W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 84%
• Approvals: CE, CSA, UL, VDE
• Output Current: 10A
• Input Voltage: 48V
• Output Voltage: 5V
• Output Power: 50
• Screening Level: Industrial
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 100C
• Product Length (mm): 36.8mm
• Product Depth (mm): 57.9mm
• Product Height (mm): 12.7mm
• Mounting Style: Through Hole
• Pin Count: 8
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: RoHS Not Applicable

dc-dc Converters; 36 to 75 Vdc Input, 5 Vdc Output; 50 W and 75 W
Thermal Considerations
Heat Transfer with Heat Sinks
Figure 28. Heat Sink Power Derating Curves;
Figure 29. Heat Sink Power Derating Curves;
14
14
20
18
16
14
12
10
20
18
16
14
12
10
8
6
4
2
0
8
6
4
2
0
0
0
10
Natural Convection; Transverse
Orientation
Natural Convection; Longitudinal
Orientation
10
LOCAL AMBIENT TEMPERATURE, T
LOCAL AMBIENT TEMPERATURE, T
20
20
30
30
40
40
50
50
60
(continued)
60
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
1 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
NO HEAT SINK
70
(continued)
70
A
A
80
(˚C)
80
(˚C)
90
90
8-2380 (C)
8-2381 (C)
100
100
Figure 30. Heat Sink Power Derating Curves;
Figure 31. Heat Sink Power Derating Curves;
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figures 26 and
27 had a thermal-conductive dry pad between the case
and the heat sink to minimize contact resistance. The
use of Figures 26 and 27 are shown in the following
example.
20
18
16
14
12
10
20
18
16
14
12
10
8
6
4
2
0
8
6
4
2
0
0
0
10
1.0 m/s (200 lfm); Transverse
Orientation
1.0 m/s (200 lfm); Longitudinal
Orientation
10
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
1/2 IN. HEAT SINK
1/4 IN. HEAT SINK
1 IN. HEAT SINK
1 IN. HEAT SINK
NO HEAT SINK
LOCAL AMBIENT TEMPERATURE, T
NO HEAT SINK
LOCAL AMBIENT TEMPERATURE, T
20
20
30
30
40
40
50
50
60
60
70
70
Lineage Power
April 2008
A
A
80
80
(˚C)
(˚C)
90
90
8-2382 (C)
8-2383 (C)
100
100