AXA003A0X4Z Lineage Power, AXA003A0X4Z Datasheet - Page 15

• Manufacturer Part Number: AXA003A0X4Z
• Description: CONVERT DC/DC 0.75 5.5V @ 3A SIP
• Manufacturer: Lineage Power
• Series: Austin MiniLynx™r
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of AXA003A0X4Z

• Output: 0.75 ~ 5.5V
• Number Of Outputs: 1
• Power (watts): 16W
• Mounting Type: Through Hole
• Voltage - Input: 8.3 ~ 14V
• Package / Case: 5-SIP Module
• 1st Output: 0.75 ~ 5.5 VDC @ 3A
• Size / Dimension: 0.90" L x 0.26" W x 0.40" H (22.9mm x 6.6mm x 10.2mm)
• Power (watts) - Rated: 16.5W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 91%
• Approvals: CSA, EN, UL, VDE
• Output Power: 17 W
• Input Voltage Range: 8.3 V to 14 V
• Output Voltage (channel 1): 0.75 V to 5.5 V
• Output Current (channel 1): 3 A
• Package / Case Size: SIP
• Output Type: Non-Isolated
• Output Voltage: 0.75 V to 5.5 V
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 555-1052; CC109104824

TM
Data Sheet
Austin MiniLynx
12V SIP Non-isolated Power Modules:
October 2, 2009
8.3 – 14Vdc Input; 0.75Vdc to 5.5Vdc Output; 3A output current
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-
compliant components. They are designed to be
processed through single or dual wave soldering
machines. The pins have an RoHS-compliant
finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat
rate of 3°C/s is suggested. The wave preheat
process should be such that the temperature of the
power module board is kept below 210°C. For Pb
solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max.
Not all RoHS-compliant through-hole products can
be processed with paste-through-hole Pb or Pb-
free reflow process. If additional information is
needed, please consult with your Lineage Power
technical representative for more details.
LINEAGE
POWER
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