MX5A-3-5SA Bourns Inc., MX5A-3-5SA Datasheet - Page 13

• Manufacturer Part Number: MX5A-3-5SA
• Description: CONV DC/DC 3-5V 5A ADJ OUT SMD
• Manufacturer: Bourns Inc.
• Series: MX(T)r
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of MX5A-3-5SA

• Output: 0.75 ~ 3.63V
• Number Of Outputs: 1
• Power (watts): 18W
• Mounting Type: Surface Mount
• Voltage - Input: 3 ~ 5.5V
• Package / Case: 5-DIP SMD Module
• 1st Output: 0.75 ~ 3.63 VDC @ 5A
• Size / Dimension: 0.80" L x 0.45" W x 0.23" H (20.3mm x 11.4mm x 5.8mm)
• Power (watts) - Rated: 18.2W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 94%
• Output Power: 18 W
• Input Voltage Range: 3 V to 5.5 V
• Input Voltage (nominal): 3.5 V
• Output Voltage (channel 1): 0.75 V to 3.63 V
• Output Current (channel 1): 5 A
• Output Type: Adjustable
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MX5A-3-5SATR

LONGFORM REV. D 08/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Soldering Requirements
Bourns recommends the following temperature profile for use on tin lead solder (Sn-Pb Eutectic) and lead free solder. For lead free
solder, the maximum temperature during the mounting process should not exceed 245 °C. Sufficient time must be allowed to fuse the
plating on the connection to ensure a reliable solder joint. However, the time above 230 °C should not exceed 60 seconds.
Water Washing
A non-clean solder paste system should be used for solder attach onto application boards. The parts are suitable for water washing
applications. However, the user must ensure that the drying process is sufficient to remove all water from the module after washing
and that the module is never powered up prior to the module being fully dried.
Inspection/Rework
Conventional techniques may be employed when replacing a unit in the application. Using a precision dispenser or a suitable mini-
stencil, a suitable volume of solder paste should be applied to the cleaned pads. Reflow can be achieved by standard SMT rework
techniques such as IR or techniques developed for BGA components.
ESD Requirements
Bourns manufactures all models in an ESD controlled environment and all product is supplied in conductive packaging to prevent
ESD damage from occurring before or during shipping. All products must be unpacked and handled using approved ESD control
procedures. Failure to do so may affect the lifetime of the converter.
Storage
The X & XT Series have an MSL rating of 1 per IPC/JEDEC J-STD-033A.
Use in Manufacturing Environment (Continued)
MX5A-3-5SA SMT Non-Isolated Power Module
300
250
200
150
100
50
0
0
Asia-Pacific:
Europe:
The Americas: Tel: [phone] • Fax: [phone]
www.bourns.com
15 30
Preheat Zone
<2.5 °C/sec.
45 60 75 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300
Tel: [phone] • Fax: [phone]
Tel: [phone] • Fax: [phone]
Fig. 32 Suggested Reflow Profile
Peak Temp. (Pb-Free Solder)
Solder Reflow Profile
Preheating Zone
(2 - 4 min. max.)
60-90 sec typical
0.5 - 0.6 °C/sec.
Soaking Zone
(2 min. max.)
Time (Seconds)
245 °C
1.3 - 1.6 °C/sec.
30-60 sec. typ.
(90 sec. max.)
Reflow Zone
Peak Temp. (Pb Solder)
Cool Down Zone
210-225 °C
13