PN120065 Toshiba, PN120065 Datasheet - Page 2

• Manufacturer Part Number: PN120065
• Description: PACKAGE CONVERTER LQFP64
• Manufacturer: Toshiba

Specifications of PN120065

• Module/board Type: Socket Module - LQFP
• For Use With/related Products: TMP91 27UG
• For Use With: PN120013 - KIT MCU PROBE SETPN210023 - MCU MOUNT ADAPTER LQFP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Part Numbering Nomenclature
Example 1
Example 2
TMP 89 F S 60 x x UG
TMP 19A 23 F Y x XBG
Package
Automotive quality grade
Microcontroller revision
Microcontroller subtype
ROM size
ROM type
Microcontroller core
Toshiba microcontrollers
Package
Part designator / Microcontroller revision
ROM size
ROM type
Microcontroller subtype
Microcontroller core
Toshiba microcontrollers
QG: Plastic shrink quad outline non-leaded package (VQON); dry-packed
XBG: Plastic ball grid array (BGA); dry-packed
WBG: Wafer level chip size package (WCSP), dry-packed
UG, DUG, FG, DFG: Plastic quad flat package (QFP); dry-packed
MG, DMG: Plastic small-outline package (SOP); dry-packed
NG: Plastic shrink dual in-line package (SDIP)
PG: Plastic standard dual in-line package (DIP)
R: Grade A, −40°C to +85°C
T: Grade A, −40°C to +125°C
I: Grade B, −40°C to +85°C
S: Grade B, −40°C to +125°C
C: Mask
E: EEPROM
F: Flash
P: OTP
47: 47E
86: 870/C
87: 870
88: 870/X
XBG: Plastic ball grid array (BGA); dry-packed
UG, FG: Plastic quad flat package (QFP); dry-packed
C: Mask
F: Flash
19
19A: 19A, 19A/H1
A9: 09
KB
KB
KB
24
1
1
K
16
H
32
M
2
2
32
M
89:
91:
92, 94: 900/H1
93:
40
N
3
3
56
R
48 60/64 96 128 192 256 384 512
P
4
4
870/C1
900/L1
900/L
M3: 03
64
S
6
6
S
2
128
W
8
8
U
95:
96:
256
12
Y
C
W
900/H
900
384
16
H
Z
F
512
Y
D
Z
768 1024 1536 2048
E
D
10
1D
20
2010/9 SCE0004K