DV251001 Microchip Technology, DV251001 Datasheet - Page 90

• Manufacturer Part Number: DV251001
• Description: KIT DEVELOPMENT CAN MCP2510
• Manufacturer: Microchip Technology

Specifications of DV251001

• Main Purpose: Interface, CAN Controller
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: MCP2510, MCP2515
• Primary Attributes: Stand alone CAN Controller with SPI
• Silicon Manufacturer: Microchip
• Application Sub Type: CAN
• Kit Application Type: Interface
• Silicon Core Number: MCP2510, MCP2515
• Kit Contents: Board Cable Power Supply CD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Lead Free Status / RoHS Status: na, Lead free / RoHS Compliant
• Other names: DV251001R; DV251001R

Ordering Information for all Microchip PICmicro®, K
XXXXXXXXXX - XX X/XX XXX
QTP, SQTP or ROM Code; Special Requirements
Package:
1M
3M
6C
7M
CB
CL
G
JW
L
LQ
ML
MF
MS
OT
P
PQ
PT
S
SB
Process Temperature:
Blank = 0°C to +70°C
I (Industrial) = -40°C to +85°C
Speed:
-90
-10
-12
-15
-17
-20
-25
-30
Option:
T = Tape and Reel Shipments
X = Rotated pinout
Device Type: (Up to 10 digits)
AA
C
C
CE
CR
F
FC
HC
HV
LC
LC
Note:
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1000pF COB Module, .75mm
330pF COB Module, .45mm
2x68pF COB Module (WORLD II)
2x68pF COB Module (IOA2)
Chip on Board (COB)
Windowed CERQUAD
Lead Free
Windowed CERDIP
Plastic Leaded Chip Carrier (PLCC)
Plastic Low Quad Flatpack (LQFP)
Quad Flat - No Leads (QFN)
Dual Flat - No Leads (DFN)
Micro Small Outline (MSOP)
5-Lead or 6-Lead SOT-23
Plastic DIP
Plastic Quad Flatpack (PQFP)
Plastic Thin Quad Flatpack (TQFP)
Die in Waffle Pack
Bumped Die in Waffle Pack
90 ns
100 ns
120 ns
150 ns
170 ns
200 ns
250 ns
300 ns
1.8V Serial EEPROM
CMOS EPROM/ROMless MCU
5V Serial EEPROM
CMOS EPROM/EEPROM MCU
CMOS ROM MCU
Flash MCU
High Speed serial EEPROM
High Speed
High Voltage
Low Voltage CMOS EPROM MCU
Low Voltage (2.5V) Serial EEPROM
Microchip offers a wide variety of lead-free package options. Contact your local sales office for availability or refer to
the list on Microchip’s web site.
EE
Part Number Suffix Designations
L
OQ
OR
®, RFID, rfHCS and Memory Products
SL
SM
SN
SO
SP
SS
ST
ST14
TO-92
TS
TT
VS
W
WB
WF
WFB
WM
E (Extended) = -40°C to +125°C
Crystal Frequency Designator for PICmicro® MCUs
LP
RC
XT
HS
02
04
04
08
10
16
20
25
30
33
40
LCE
LCR
LCS
LF
LV
24
25
93
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14-lead Small Outline (150 mil)
8-lead Small Outline (207 mil)
8-lead Small Outline (150 mil)
Plastic Small Outline (SOIC) (300 mil)
Plastic Skinny DIP
Plastic Shrink Small Outline (SSOP)
Thin Shrink Small Outline (TSSOP 4.4 mm)
14-lead Thin Shrink Small Outline (TSSOP-14)
Transistor Outline
Thin Small Outline (8mm x 20mm)
SOT-23-3 Small Outline Transistor
Very Small Outline (8mm x 12mm)
Uncut Wafer
Bumped Wafer
Sawed Wafer on Frame
Bumped, Sawed Wafer on Frame
SOT385 Leadless Module
DC to 40 kHz, Low Power Crystal Oscillator
DC to 4 MHz, Resistor/Capacitor Oscillator
DC to 4 MHz, Standard Crystal Resonator Oscillator
DC to 20 MHz, High Speed Crystal Oscillator
DC to 2 MHz, XT and RC Oscillator Support
DC to 4 MHz Internal, XT and RC Oscillator Support
DC to 200 kHz, LP Oscillator Support
DC to 8 MHz, HS Oscillator Support
DC to 10 MHz, HS Oscillator Support
DC to 16 MHz, XT Oscillator Support
DC to 20 MHz, HS Oscillator Support
DC to 25 MHz, XT Oscillator Support
DC to 30 MHz, HS Oscillator Support
DC to 33 MHz, XT Oscillator Support
DC to 40 MHz, HS Oscillator Support
Low Voltage CMOS EPROM/EEPROM MCU
Low Voltage CMOS ROM MCU
Low Voltage Security
Low Voltage FLASH MCU
Low Voltage
2-Wire (I
SPI
3-Wire (Microwire)
2
C)