ATA6663-EK Atmel, ATA6663-EK Datasheet - Page 57

• Manufacturer Part Number: ATA6663-EK
• Description: BOARD EVALUATION FOR ATA6663
• Manufacturer: Atmel

Specifications of ATA6663-EK

• Main Purpose: Interface, LIN
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: ATA6663
• Primary Attributes: LIN Transceiver, LIN 2.1, SAEJ2602-2, Baud Rate Down to 1kBd
• Secondary Attributes: 4 Power Modes: Pre-Normal, Normal, Sleep, 8-SOIC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

50
N
Serial EEPROMs Standard Products (Continued)
* Available on Request
Part Number
SPI Interface
AT25010A
AT25020A
AT25040A
AT25080A
AT25080B
AT25160A
AT25160B
AT25320A
AT25320B
AT25640A
AT25640B
AT25128A
AT25128B
AT25256A
AT25256B
AT25512
3-wire Interface
AT93C46D
AT93C46E
AT93C56A
AT93C56B
AT93C66A
AT93C66B
AT93C86A
ONVOLATILE
Density
(Kbits) Organization VCC (V)
128
128
256
256
512
16
16
32
32
64
64
16
1
2
4
8
8
1
1
2
2
4
4
ATMEL PRODUCT GUIDE
M
64 x 16/128
1024 x 16/
16384 x 8
16384 x 8
32768 x 8
32768 x 8
65536 x 8
128 x 16/
128 x 16/
256 x 16/
256 x 16/
EMORY
1024 x 8
1024 x 8
2048 x 8
2048 x 8
4096 x 8
4096 x 8
8192 x 8
8192 x 8
2048 x 8
128 x 8
256 x 8
512 x 8
64 x 16
256 x 8
256 x 8
512 x 8
512 x 8
x 8
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
1.8, 2.7
(C
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
ONTINUED
Speed
(MHz)
Max
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2
2
2
2
2
2
2
)
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN*, Die/Wafer
DFN (MAP), XDFN, Die/Wafer
DFN (MAP), XDFN, Die/Wafer
SOIC, TSOP, DFN, Die/Wafer
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, dBGA2,
PDIP, SOIC, TSSOP, DFN
PDIP, SOIC, TSSOP, DFN
PDIP, SOIC, TSSOP, DFN
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (MAP), Die/Wafer
DFN (SAP), Die/Wafer
DFN (SAP), Die/Wafer
PDIP, SOIC, TSSOP
(MAP), Die/Wafer
(SAP), Die/Wafer
(SAP), Die/Wafer
Package
SPI Mode 0 and 3, SW/HW
SPI Mode 0 and 3, SW/HW
x8 or x16 Organization
x8 or x16 Organization
x8 or x16 Organization
x8 or x16 Organization
x8 or x16 Organization
x8 or x16 Organization
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
SW/HW Write Protect
with Sequential Read
with Sequential Read
with Sequential Read
with Sequential Read
with Sequential Read
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
SPI Mode 0 and 3,
x16 Organization
All Serial EEPROMs Parts are RoHS Compliant.
Write Protect
Write Protect
Comments
January 2008
Now (Replaces
Now (Replaces
Now (Replaces
Now (Replaces
AT25HP256)
AT25HP512)
Availability
AT93C46A)
AT93C46)
2Q2008
2Q2008
2Q2008
2Q2008
2Q2008
2Q2008
2Q2008
2Q2008
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now
Now