EVAL6206N STMicroelectronics, EVAL6206N Datasheet - Page 18

• Manufacturer Part Number: EVAL6206N
• Description: EVAL BOARD FOR L6206N DIP
• Manufacturer: STMicroelectronics

Specifications of EVAL6206N

• Mfg Application Notes: PractiSPIN AppNote
• Design Resources: EVAL6206N/6206N Gerber Files EVAL6206N Schematic/Bill of Materials
• Main Purpose: Power Management, H Bridge Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: L6205N DIP
• Primary Attributes: Dual Full-Bridge (H-Bridge), 2.8A (5.6A Peak). 8 ~ 52 V, 0.3 Ohm
• Secondary Attributes: Non-Inverting, Can be Paralleled
• Architecture: Analog
• Applications: Motor Control
• Processor To Be Evaluated: L6206
• For Use With: 497-4138 - EVALUATION BOARD PRACTISPIN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5487

L6206
Figure 18. Mounting the PowerSO package.
Figure 19. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
Figure 20. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.
Figure 21. SO24 Junction-Ambient thermal resistance versus on-board copper area.
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º C / W
ºC / W
ºC / W
49
48
47
46
45
44
43
42
41
40
39
43
38
33
28
23
18
13
68
66
64
62
60
58
56
54
52
50
48
1
1
1
2
2
2
3
3
3
4
dissipating area
4
4
Slug soldered
to PCB with
5
5
5
6
s q . c m
s q . cm
s q. cm
6
6
7
W ith o ut G ro u nd La yer
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
H o le s
C o pp er A re a is o n T op S id e
7
7
8
C o p pe r Are a is o n Bo tto m
S id e
C o p pe r Are a is o n To p S i de
8
8
9
9
9
10
10
10
1 1
plus ground layer
dissipating area
Slug soldered
to PCB with
11
11
1 2
12
12
13
dissipating area plus ground layer
contacted through via holes
Slug soldered to PCB with
On-Board Copper Area
On-Board Copper Area
On-Board Copper Area