KIT33879AEKEVBE Freescale Semiconductor, KIT33879AEKEVBE Datasheet - Page 6

• Manufacturer Part Number: KIT33879AEKEVBE
• Description: BOARD EVALUATION FOR MC33879
• Manufacturer: Freescale Semiconductor
• Type: PWM Controllersr

Specifications of KIT33879AEKEVBE

• Main Purpose: Power Management, High & Low Side Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33879
• Primary Attributes: 8-output hardware-configurable
• Secondary Attributes: 16-bit serial input control
• Interface Type: SPI
• Product: Power Management Modules
• Silicon Manufacturer: Freescale
• Silicon Core Number: MC33879
• Kit Application Type: Power Management
• Application Sub Type: Switch
• Kit Contents: Board, CD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MC33879

Table 3. 33879 Maximum Ratings
permanent damage to the device.
6
33879
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
V
CS
V
Output Clamp Energy
ESD Voltage
Operating Temperature
Storage Temperature
Power Dissipation
Thermal Resistance
Peak Package Reflow Temperature During Reflow
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
DD
PWR
1.
2.
3.
4.
5.
6.
, DI, DO, SCLK, IN5, IN6, and EN
Human Body Model 33879
Machine Model 33879
Human Body Model
Machine Model
Ambient
Junction
Case
Junction to Ambient
Between the Die and the Exposed Die Pad
Supply Voltage
Exceeding these limits may cause malfunction or permanent damage to the device.
Maximum output clamp energy capability at 150
ESD1 testing is performed in accordance with the Human Body Model (C
accordance with the Machine Model (C
Maximum power dissipation at T
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Supply Voltage
(3)
(4)
(1)
(2)
(1)
33879
33879A
33879A
33879A
Ratings
(1)
A
= 25
ELECTRICAL CHARACTERISTICS
°
ZAP
C with no heatsink used.
= 200 pF, R
(5),
°
(6)
C junction temperature using single non-repetitive pulse method with I = 350 mA.
MAXIMUM RATINGS
ZAP
= 0 Ω).
ZAP
= 100 pF, R
Symbol
E
V
V
V
V
T
V
CLAMP
T
R
R
V
ESD1
ESD2
ESD1
ESD2
PPRT
PWR
T
P
T
T
STG
θ
θ
DD
–
A
C
D
J
JA
JC
ZAP
Analog Integrated Circuit Device Data
= 1500 Ω), ESD2 testing is performed in
- 0.3 to 7.0
- 0.3 to 7.0
- 40 to 125
- 40 to 150
- 40 to 125
- 55 to 150
-16 to 40
-16 to 45
±2000
Value
Note 6
± 450
±100
±200
1.2
50
1.7
71
Freescale Semiconductor
°
Unit
V
V
V
C/W
mJ
°
°
°C
DC
DC
DC
V
W
C
C