NCP4894FCEVB ON Semiconductor, NCP4894FCEVB Datasheet - Page 11

• Manufacturer Part Number: NCP4894FCEVB
• Description: EVAL BOARD FOR NCP4894FC
• Manufacturer: ON Semiconductor

Specifications of NCP4894FCEVB

• Design Resources: NCP4894 Demo Board BOM NCP4894FCEVB Gerber Files NCP4894 Demo Board Schematic
• Amplifier Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.8W x 1 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Board Type: Fully Populated
• Utilized Ic / Part: NCP4894
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP4894FC
• Other names: NCP4894FCEVBOS

700
600
500
400
300
200
100
0.25
0.15
0.05
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.2
0.1
0
0
0
Figure 29. Power Derating − 9−Pin Flip−Chip CSP
0
0
0
200 mm
P
for VP = 5 V,
R
Figure 25. Power Dissipation versus Output
Figure 27. Power Dissipation versus Output
Dmax
L
= 8 W
20
= 633 mW
0.2
2
T
50 mm
A
40
, AMBIENT TEMPERATURE (°C)
0.1
P
P
out
out
2
0.4
, OUTPUT POWER (W)
, OUTPUT POWER (W)
60
VP = 5 V
R
F = 1 kHz
THD + N < 0.1%
L
= 8 W
Power
VP = 3 V
R
F = 1 kHz
THD + N < 0.1%
Power
L
80
0.6
0.2
= 8 W
TYPICAL PERFORMANCE CHARACTERISTICS
PCB Heatsink Area
500 mm
100
0.8
120
2
0.3
1
140
http://onsemi.com
160
NCP4894
1.2
0.4
11
0.35
0.25
0.15
0.05
180
160
140
120
100
0.25
0.15
0.05
0.4
0.3
0.2
0.1
80
60
40
0.3
0.2
0.1
0
0
50
0
0
Figure 30. Maximum Die Temperature versus
VP = 2.6 V
Figure 28. Power Dissipation versus Output
Figure 26. Power Dissipation versus Output
0.05
VP = 3.3 V
VP = 4.2 V
100
0.1
0.1
R
PCB HEATSINK AREA (mm
VP = 5 V
P
L
P
PCB Heatsink Area
out
= 4 W
R
out
VP = 2.6 V
F = 1 kHz
THD + N < 0.1%
L
, OUTPUT POWER (W)
, OUTPUT POWER (W)
0.15
= 8 W
Maximum Die Temperature 150°C
150
VP = 3.3 V
R
F = 1 kHz
THD + N < 0.1%
0.2
L
Power
= 8 W
Power
0.2
200
0.3
0.25
2
0.3
)
250
0.4
0.35
300
0.5
0.4