AS1339 EB austriamicrosystems, AS1339 EB Datasheet - Page 4

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AS1339 EB

Manufacturer Part Number
AS1339 EB
Description
BOARD EVAL AS1339
Manufacturer
austriamicrosystems
Datasheets

Specifications of AS1339 EB

Main Purpose
DC/DC, Step Down with LDO
Outputs And Type
3, Non-Isolated
Voltage - Output
0.8 ~ 3.75 V, 2.85V, 2.85V
Current - Output
650mA
Voltage - Input
2.7 ~ 5.5 V
Regulator Topology
Buck
Frequency - Switching
2MHz
Board Type
Fully Populated
Utilized Ic / Part
AS1339
Lead Free Status / RoHS Status
Lead free by exemption / RoHS compliant by exemption
Power - Output
-
AS1339
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
and functional operation of the device at these or any other conditions beyond those indicated in
istics on page 5
device reliability.
Table 2. Absolute Maximum Ratings
www.austriamicrosystems.com/DC-DC_Step-Down/AS1339
PAA, PAB, PA_EN, TEST, REFIN,
LDO1, LDO2, EN1, EN2 to AGND
Junction Temperature (T
Ambient Temperature (T
REFIN Common-Mode Range
Continuous Power Dissipation
Storage Temperature Range
Package Body Temperature
IN1A, IN1B, IN2 to AGND
Human Body Model
IN2 to IN1B/IN1A
PGND to AGND
Bypass Current
NC to AGND
Parameter
LX Current
P
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
D-MAX
A
J
) Range
) Range
Table 2
may cause permanent damage to the device. These are stress ratings only,
Min
-0.3
-0.3
-0.3
-0.3
-0.3
-65
-40
-40
0
1
V
V
V
+150
+260
+125
Max
IN1B
+0.3
+0.3
0.75
+85
0.3
IN2
0.3
V
0.8
1.6
IN1A
+7
IN
Revision 1.05
+
/
+
Units
A
A
kV
RMS
RMS
ºC
ºC
ºC
ºC
W
V
V
V
V
V
V
of the device in the application (P
part/package in the application (θ
temperature (T
Sensitivity Classification for Non-Hermetic Solid
equation: T
dependent on the maximum operating junction
The reflow peak soldering temperature (body
T
junction-to ambient thermal resistance of the
temperature) specified is in accordance with
In applications where high power dissipation
present, the maximum ambient temperature
IPC/JEDEC J-STD-020D “Moisture/Reflow
Maximum ambient temperature (T
A
and/or poor package thermal resistance is
= +65ºC; derate 12.5mW/ºC above +65ºC
HBM MIL-Std. 883E 3015.7 methods
State Surface Mount Devices”.
A-MAX
may have to be derated.
J-MAX-OP
power dissipation
the following
= T
Comments
J-MAX-OP
= 125ºC), the maximum
Electrical Character-
– (θ
D-MAX
JA
JA
), as given by
A-MAX
× P
), and the
D-MAX
) is
4 - 25
).

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