MAX15059EVKIT+ Maxim Integrated Products, MAX15059EVKIT+ Datasheet - Page 2

• Manufacturer Part Number: MAX15059EVKIT+
• Description: EVAL KIT FOR MAX15059
• Manufacturer: Maxim Integrated Products

Specifications of MAX15059EVKIT+

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TQFN
ELECTRICAL CHARACTERISTICS
(V
= 0V, T
MAX15059BATE+, unless otherwise noted. Typical values are at T
76V, 300mW Boost Converter and Current
Monitor for APD Bias Applications
ABSOLUTE MAXIMUM RATINGS
IN, SHDN, FB, ILIM, RLIM, CNTRL to SGND ..........-0.3V to +6V
LX to PGND ...........................................................-0.3V to +80V
BIAS to SGND ......................................................-0.3V to +79V
APD, CLAMP to SGND ........................... -0.3V to (V
PGND to SGND ....................................................-0.3V to +0.3V
MOUT to SGND .................................. -0.3V to (V
Continuous Power Dissipation (T
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
INPUT SUPPLY
Supply Voltage Range
Supply Current
Undervoltage-Lockout
Threshold
Undervoltage-Lockout
Hysteresis
Shutdown Current
Shutdown BIAS Current
BOOST CONVERTER
Output-Voltage Adjustment
Range
Switching Frequency
Maximum Duty Cycle
FB Set-Point Voltage
FB Input-Bias Current
Internal Switch On-Resistance
Peak Switch Current Limit
Peak Current-Limit Response
IN
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
16-Pin TQFN-EP (derate 20.8mW/NC above +70NC) ....1666.7mW
______________________________________________________________________________________
= V
A
SHDN
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
= -40NC to +85NC for the MAX15059AETE+ and MAX15059BETE+ and T
= V
CNTRL
= 3.3V. C
A
V
I
IN
BIAS_SHDN
SYMBOL
UVLO_HYS
= +70NC)
V
I
I
SUPPLY
V
I
LIM_LX
= 1FF, V
D
FB_SET
SHDN
R
UVLO
f
V
I
SW
CLK
FB
ON
IN
JC
PGND
) .................7°C/W
JA
V
switching
V
V
V
V
V
V
I
V
MAX15059A
MAX15059B
LX
FB
IN
SHDN
BIAS
IN
IN
FB
IN
) ..........48°C/W
CLAMP
= 100mA,
rising
= 5V
= 2.8V
= 2.8V
= V
BIAS
= 1.4V, no
= V
= 3.3V, V
= 0V
FB_SET
SGND
+ 0.3V)
+ 0.3V)
= 0V, V
, T
SHDN
T
T
T
T
A
CONDITIONS
A
A
A
A
= +25NC
A
= -40°C to +85°C
= +125°C
= -40°C to +85°C
= +125°C
= 0V
BIAS
= +25NC.) (Note 2)
Operating Temperature Range
Operating Temperature Range .......................... -40NC to +85NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
MAX15059AETE, MAX15059BETE ................. -40NC to +85NC
MAX15059AATE, MAX15059BATE .............. -40NC to +125NC
= 40V. LX = APD = CLAMP = ILIM = unconnected, V
A
= -40NC to +125NC for the MAX15059AATE+ and
V
2.475
1.205
0.825
IN
MIN
380
100
2.8
1.1
88
+ 5
0.003
TYP
1.23
200
400
100
0.6
2.6
1.2
0.9
90
9
1
2.775
1.255
0.975
MAX
1.35
2.25
420
500
5.5
1.2
1.3
20
76
92
2
2
UNITS
kHz
mA
mV
FA
FA
nA
ns
MOUT
%
W
A
V
V
V
V