AD8260-EVALZ Analog Devices Inc, AD8260-EVALZ Datasheet - Page 32

• Manufacturer Part Number: AD8260-EVALZ
• Description: BOARD EVAL FOR AD8260
• Manufacturer: Analog Devices Inc

Specifications of AD8260-EVALZ

• Channels Per Ic: 1 - Single
• Amplifier Type: Variable Gain
• Output Type: Differential
• Slew Rate: 730 V/µs
• -3db Bandwidth: 195MHz
• Current - Output / Channel: 310mA
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (main Ic): 28.3mA
• Voltage - Supply, Single/dual (±): 3.3 V ~ 10 V, ±3.3 V ~ 5 V
• Board Type: Fully Populated
• Utilized Ic / Part: AD8260
• Silicon Manufacturer: Analog Devices
• Application Sub Type: Programmable Gain Amplifier
• Kit Application Type: Amplifier
• Silicon Core Number: AD8260
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD8260
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD8260ACPZ-R7
AD8260ACPZ-RL
AD8260ACPZ-WP
AD8260-EVALZ
1
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
SEATING
PLANE
1
1.00
0.85
0.80
INDICATOR
1
1
1
PIN 1
12° MAX
Temperature
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
BSC SQ
VIEW
5.00
TOP
0.30
0.25
0.18
0.80 MAX
0.65 TYP
D07192-0-5/08(0)
Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
BSC SQ
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.20 REF
4.75
0.05 MAX
0.02 NOM
5 mm × 5 mm Body, Very Thin Quad
Dimensions shown in millimeters
0.60 MAX
COPLANARITY
Rev. 0 | Page 32 of 32
0.08
BSC
0.50
0.50
0.40
0.30
(CP-32-8)
24
17
25
16
0.60 MAX
(BOT TOM VIEW)
EXPOSED
3.50 REF
PAD
32
9
8
1
THE EXPOSED PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO THE
GROUND PLANE. THE GROUND PLANE
PATTERN SHOULD INCLUDE A PATTERN OF
VIAS TO INNER LAYERS.
0.20 MIN
PIN 1
INDICATOR
2.85
2.70 SQ
2.55
Package Option
CP-32-8
CP-32-8
CP-32-8