MCP6XXXEV-AMP1 Microchip Technology, MCP6XXXEV-AMP1 Datasheet - Page 30

• Manufacturer Part Number: MCP6XXXEV-AMP1
• Description: BOARD AMPLIFIER EVAL 1 MCP6XXX
• Manufacturer: Microchip Technology

Specifications of MCP6XXXEV-AMP1

• Channels Per Ic: 1 - Single
• Amplifier Type: General Purpose
• Board Type: Partially Populated
• Utilized Ic / Part: 8-DIP Package
• Processor To Be Evaluated: MCP6xxx
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Output Type: -
• Current - Output / Channel: -
• Voltage - Supply, Single/dual (±): -
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply (main Ic): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP6XXX Amplifier Evaluation Board 1 User’s Guide
DS51667A-page 26
2.4.3
There are two options available when using single op amps in SOIC-8 packages
(150 mil wide):
• Soldering onto the MCP6XXX Amplifier Evaluation Board 1,or
• Soldering it onto a separate board which is connected to the DIP-8 socket
Figure 2-29 shows a SOIC-8 op amp soldered onto the MCP6XXX Amplifier Evaluation
Board 1.
FIGURE 2-29:
Amplifier Evaluation Board 1.
Figure 2-30 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc
(order # SOIC8EV). The two interconnect strips on the bottom are Samtec part #
BBS-14-T-B or equivalent and are soldered into the through holes for the DIP-8 socket.
Figure 2-31 shows the SOIC8EV board plugged into the MCP6XXX Amplifier
Evaluation Board 1.
Note:
Note:
Amplifier Modification: Using 8-Pin SOIC Op Amps
The DIP-8 socket must be empty; only one op amp can be used at a time.
Insert the interconnect strips into the DIP-8 socket on the MCP6XXX
Amplifier Evaluation Board 1. Place the SOIC8EV board on the top of the
interconnect strips with the same pin orientation. Now solder the strips to
the top board; this procedure ensures correct alignment of the strips. Clip
the pins flush with the top surface of the SOIC8EV board, then solder the
SOIC-8 op amp on the top.
Op Amp in SOIC-8 package soldered onto the MCP6XXX
© 2007 Microchip Technology Inc.