MCP9800DM-DL2 Microchip Technology, MCP9800DM-DL2 Datasheet - Page 25

BOARD DEMO 2 FOR MCP9800

MCP9800DM-DL2

Manufacturer Part Number
MCP9800DM-DL2
Description
BOARD DEMO 2 FOR MCP9800
Manufacturer
Microchip Technology

Specifications of MCP9800DM-DL2

Sensor Type
Temperature
Sensing Range
-55°C ~ 125°C
Interface
I²C, SMBus
Sensitivity
±0.5°C
Voltage - Supply
2.7 V ~ 5.5 V
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP9800
Processor To Be Evaluated
MCP9800, MCP101, PIC10F202, 24LC16B
Interface Type
I2C
Lead Free Status / RoHS Status
Not applicable / Not applicable
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MO-187
Drawing No. C04-111
p
B
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
c
n
β
(F)
Dimension Limits
E1
E
Units
A2
E1
A1
n
p
E
D
L
F
B
α
A
φ
c
β
MIN
.030
.000
.016
.003
.009
-
2
1
.118 BSC
.118 BSC
.193 TYP.
.037 REF
INCHES
.026 BSC
NOM
D
8
L
.033
.024
.006
.012
-
-
-
-
-
φ
A
MAX
A1
.043
.037
.006
.016
.009
.031
15°
15°
MCP9800/1/2/3
MIN
0.75
0.00
0.40
0.08
0.22
-
MILLIMETERS*
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
8
0.85
0.60
-
-
-
-
-
-
-
DS21909B-page 25
α
MAX
1.10
0.95
0.15
0.80
0.23
0.40
15°
15°
A2

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