CYIL1SM4000-EVAL Cypress Semiconductor Corp, CYIL1SM4000-EVAL Datasheet - Page 25

BOARD EVAL IMAGE SENS LUPA-4000

CYIL1SM4000-EVAL

Manufacturer Part Number
CYIL1SM4000-EVAL
Description
BOARD EVAL IMAGE SENS LUPA-4000
Manufacturer
Cypress Semiconductor Corp
Datasheets

Specifications of CYIL1SM4000-EVAL

Sensor Type
CMOS Imaging, Monochrome
Sensing Range
4 Megapixel
Interface
SPI
Sensitivity
15 fps
Voltage - Supply
2.5 V ~ 3.3 V
Embedded
No
Utilized Ic / Part
LUPA-4000
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Bonding Diagram
The die is bonded to the bonding pads of the package as shown in
Additional Package Information
Document Number: 38-05712 Rev. *F
Die size: 25610 µm X 27200 µm
Cavity pad: 27000 µm X 29007 µm
Pixel 0,0 is located at 478 µm from the left hand side of the die and 1366 µm from the bottom side of the die.
Figure 24. Bonding Pads Diagram of the LUPA 4000 Package
Figure
24.
CYIL1SM4000AA
001-48359 **
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