C8051F330DK Silicon Laboratories Inc, C8051F330DK Datasheet - Page 37

• Manufacturer Part Number: C8051F330DK
• Description: DEV KIT FOR C8051F330/F331
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F330DK

• Contents: Evaluation Board, Power Supply, USB Cables, Adapter and Documentation
• Processor To Be Evaluated: C8051F33x
• Interface Type: RS-232
• Operating Supply Voltage: 7 V to 15 V
• Silicon Manufacturer: Silicon Labs
• Core Architecture: 8051
• Silicon Core Number: C8051F330
• Silicon Family Name: C8051F33x
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: Silicon Laboratories C8051F330, C8051F331
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1264

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95 mm openings on a 1.1 mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (71% Paste Coverage).
Body Components.
Figure 4.3. QFN-20 Recommended PCB Land Pattern
Table 4.3. QFN-20 PCB Land Pattern Dimesions
0.20
Min
3.70
3.70
0.50
Max
0.30
Rev. 1.7
Dimension
X2
Y1
Y2
C8051F330/1/2/3/4/5
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25
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