M52259EVB Freescale Semiconductor, M52259EVB Datasheet - Page 27

• Manufacturer Part Number: M52259EVB
• Description: BOARD EVAL FOR 52259 COLDFIRE V2
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®r
• Type: MCUr

Specifications of M52259EVB

• Contents: Board, Cables, Documentation, DVD, Flash Drive and Power Supply
• Processor To Be Evaluated: MCF52259
• Data Bus Width: 32 bit
• Interface Type: RS-232, Ethernet, USB
• Silicon Manufacturer: Freescale
• Core Architecture: Coldfire
• Core Sub-architecture: Coldfire V2
• Silicon Core Number: MCF52
• Silicon Family Name: MCF5225x
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• For Use With/related Products: MCF52259
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Characteristics
27
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

recommends the use of 
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the 
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.

recommends the use of 
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the 
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.

recommends the use of 
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the 
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
100 LQFP
JA
JA
JA
and 
and 
and 
jt
jt
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
JA
JA
JA
and power dissipation specifications in the system design to prevent device junction
and power dissipation specifications in the system design to prevent device junction
and power dissipation specifications in the system design to prevent device junction
Table 8. Thermal Characteristics (continued)
MCF52259 ColdFire Microcontroller, Rev. 4
Characteristic
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
—
—
—
Symbol







JMA
JMA
T
JA
JA
JB
JC
jt
jt
jt
jt
j
parameter, the device power
parameter, the device power
parameter, the device power
Freescale Semiconductor
53
39
Value
42
33
25
105
9
2
13,14
1,15
17
18
1,3
1,3
16
C / W
C / W
C / W
C / W
C / W
C / W
C / W
Unit
o
C