MPC5534EVBE Freescale Semiconductor, MPC5534EVBE Datasheet - Page 54
![BOARD EVAL FOR MPC5534](/photos/9/26/92612/mpc5534evbe_sml.jpg)
MPC5534EVBE
Manufacturer Part Number
MPC5534EVBE
Description
BOARD EVAL FOR MPC5534
Manufacturer
Freescale Semiconductor
Type
MCUr
Datasheet
1.LFM34INTPU1A.pdf
(60 pages)
Specifications of MPC5534EVBE
Contents
Eval Board and Demo Software
Processor To Be Evaluated
MPC55xx
Data Bus Width
32 bit
Interface Type
RS-232, Ethernet
Operating Supply Voltage
5 V
For Use With/related Products
MPC5534
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Revision History for the MPC5534 Data Sheet
The following table describes the changes made to information in tables and figures, and is presented in
sequential page number order.
54
Figure
Table
Table
Table
Location
1, Orderable Part Numbers:
2, Absolute Maximum Ratings:
3, MPC5534 Thermal Characteristics:
1, MPC5500 Family Part Numbers:
Changed for production purposes, footnote 1 from:
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
to:
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal
resistance.
• Removed the 2 in the tape and reel designator in both the graphic and in the Tape and Reel Status text.
• Changed Qualification Status by adding ‘, general market flow’ to the M designator, and added an ‘S’ designator
• Footnote 1 added that reads: All devices are PPC5534, rather than MPC5534 or SPC5534, until product
• Reordered rows to group devices by lead-free package types in descending frequency order, and leaded
• Footnote 2 added that reads:’ The lowest ambient operating temperature is referenced by T
• Footnote 3 added that reads: ‘Speed is the nominal maximum frequency. Max speed is the maximum speed
• Deleted Spec 3, “Flash core voltage.”
• Spec 12 “DC Input Voltage”: Deleted from second line‘. . .except for eTPUB[15] and SINB (DSPI_B_SIN)’ leaving
• Spec 12 “DC Input Voltage”: Added footnote 8 to second line “V
• Spec 14, column 2, changed: ‘V
• Spec 15, column 2, changed: ‘V
• Spec 21, Added the name of the spec, ‘V
• Spec 28 “Maximum Solder Temperature”: Added two lines:
• Footnote 1, added: ‘any of’ between ‘beyond’ and ‘the listed maxima.’
• Deleted footnote 2: ‘Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum
• Footnote 6 (now footnote 5): Changed the end of the last sentence as follows; “Internal structures hold the input
with the description of ‘Fully spec. qualified, automotive flow.
qualifications are complete. Not all configurations are available in the PPC parts.
package types.
operating temperature is referenced by T
allowed including frequency modulation (FM). 42 MHz parts allow for 40 MHz system clock + 2% FM; 68 MHz
parts allow for 66 MHz system clock + 2% FM, and 82 MHz parts allow for 80 MHz system clock + 2% FM.’
V
min. and max values of -0.3 and 6.5 respectively, and deleted old footnote 7.
structures hold the input voltage less than the maximum voltage on all pads powered by the V
maximum injection current specification is met (s mA for all pins) and V
specifications.
reference to
Lead free (PbFree) and Leaded (SnPb) with maximum values of 260 C and 245 C respectively.
specifications for device stress have not yet been determined.’Spec 26 “Maximum Operating Temperature
Range”: replaced -40 C with.
voltage greater than -1.0 V if the injection current limit of 2 mA is met. Keep the negative DC voltage greater than
-0.6 V on eTPU[15] and on SINB during the internal power-on reset (POR) state.”
DDEH
powered I/O pads. Deleted third line ‘V
Table 30. Table and Figure Changes Between Rev. 3.0 and 4.0
Table
9, DC Electrical Specifications, to which the Spec was moved.
MPC5534 Microcontroller Data Sheet, Rev. 5
SS
DD
differential voltage’ to ‘V
differential voltage’ to ‘V
H
RC33
Description of Changes
.’
DDEH
to V
DDSYN
powered by I/O pads (eTPUB[15] and SINB), including the
differential voltage,’ as well as the name and cross
SS
DD
to V
to V
DDE
SSA
DDA
powered I/O pads” that reads: ‘Internal
differential voltage.’
differential voltage.’
DDE
is within the operating voltage
Freescale Semiconductor
L
; the highest ambient
DDE
supplies, if the