NBSG53ABAEVB ON Semiconductor, NBSG53ABAEVB Datasheet - Page 17

• Manufacturer Part Number: NBSG53ABAEVB
• Description: BOARD EVAL BBG NBSG53ABA
• Manufacturer: ON Semiconductor

Specifications of NBSG53ABAEVB

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: NBSG53A
• Other names: NBSG53ABAEVB; NBSG53ABAEVBOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−Y−
3 X
E
A
e
0.20
S
A2
−X−
ROTATED 90 CLOCKWISE
A1
VIEW M−M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
−Z−
CASE 489−01
FCBGA−16
BA SUFFIX
M
M
K
ISSUE O
Z
Z
17
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
D
b
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
1.20 REF
MAX
0.35
0.50