OM11024 NXP Semiconductors, OM11024 Datasheet
OM11024
Manufacturer Part Number
OM11024
Description
KIT EVAL FOR LPC313X
Manufacturer
NXP Semiconductors
Type
Microcontrollerr
Specifications of OM11024
Contents
2 Boards, cable and software
For Use With/related Products
LPC3131
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4719
Industry’s Lowest Cost ARM9
with High Speed USB 2.0 OTG
Embedded designers can now take advantage of higher performance, lower cost, lower
power consumption and small footprint in applications requiring flexible USB connectivity.
Key Features
CPU Platform
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Internal Memory
}
External Memory Interface
}
}
Communication & Connectivity
}
}
}
}
}
}
}
}
180-MHz, 32-bit ARM926EJ-S
16 KB D-Cache & 16 KB I-Cache
Memory Management Unit (MMU)
96 KB (LPC3130) or 192 KB (LPC3131)
embedded SRAM
NAND Flash Controller with
8-bit ECC
8/16-bit Multi-Port Memory Controller
(MPMC): SDRAM and SRAM
High Speed USB 2.0 OTG with
on-chip PHY
Two I
Integrated Master/Slave SPI
Two Master/Slave I
Fast UART
Memory Card Interface (MCI):
MMC/SD/SDIO/CE-ATA
Four channel 10-bit ADC
Integrated 4/8/16-bit 6800/8080
compatible LCD interface
2
S interfaces
2
C
System Function
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}
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}
}
}
}
}
}
Operating Voltage & Temperature
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}
Package
}
Applications
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}
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Dynamic clock gating & scaling
Multiple power domains
Selectable boot-up: SPI Flash, NAND
Flash, SD/MMC cards, UART or USB
DMA controller
Four 32-bit timers
Watchdog timer
PWM module
Random Number Generator (RNG)
General-Purpose I/O pins (GPIO)
Flexible & versatile Interrupt Structure
JTAG interface with boundary scan
and ARM debug access
Core Voltage: 1.2 V
I/O Voltage: 1.8, 2.8, 3.3 V
Temperature: -40 °C to +85 °C
TFBGA180: 12x12 mm
Consumer
Industrial
Medical
Communication
Automotive
NXP ARM926EJ-S
processor LPC313x
2
, 0.8 mm pitch
The NXP LPC313x family combines an
180-MHz ARM926EJ CPU core, High
Speed USB 2.0 OTG, up to 192 KB
SRAM, NAND Flash Controller, flexible
external bus interface, four channel
10-bit A/D and a myriad of serial and
parallel interfaces. To optimize system
power consumption, the LPC313x has
multiple power domains and a very
flexible Clock Generation Unit (CGU)
that provides dynamic clock gating
and scaling.
The USB interface contains UTMI+
compliant transceiver (PHY), dedicated
PLL, and a dedicated DMA engine
providing high speed transfer rates
(up to 480 Mbps) and supports device,
host and On-The-Go (OTG) operations.
The LPC313x allows booting from
NAND Flash, SPI Flash, SD/MMC cards,
UART, or USB. The integrated NAND
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OM11024 Summary of contents
Page 1
Industry’s Lowest Cost ARM9 with High Speed USB 2.0 OTG Embedded designers can now take advantage of higher performance, lower cost, lower power consumption and small footprint in applications requiring flexible USB connectivity. Key Features CPU Platform 180-MHz, 32-bit ARM926EJ-S ...
Page 2
Flash controller provides an 8-bit Error Correction Code (ECC) and supports up to four NAND flash devices which can be any combination of SLC type NAND flash and MLC type NAND flash capacity of 16 GB. An ...