MPC5553EVBISYS Freescale Semiconductor, MPC5553EVBISYS Datasheet - Page 60

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MPC5553EVBISYS

Manufacturer Part Number
MPC5553EVBISYS
Description
KIT EVAL ISYSTEMS MPC5553
Manufacturer
Freescale Semiconductor
Type
Microcontrollerr
Datasheet

Specifications of MPC5553EVBISYS

Contents
Eval Board and Demo Software
Processor To Be Evaluated
MPC55xx
Data Bus Width
32 bit
Interface Type
RS-232, Ethernet
Core Architecture
Power
For Use With/related Products
MPC5553
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Revision History for the MPC5553 Data Sheet
5
The history of revisions made to this data sheet are described in this section. The changes are divided into
each revision of this document.
The substantive changes incorporated in MPC5553 Data Sheet Rev. 2.0 to produce Rev. 3.0 are:
Within each group, the changes are listed in sequential page number order.
5.1
The following table lists the global changes incorporated throughout the document, and substantive text
changes made to paragraphs.
60
Global Changes
Section 1,
3.7.1, 3.7.2 and 3.7.3:
Location
Global and text changes
Table and figure changes
“Overview”:
Revision History for the MPC5553 Data Sheet
Information Changed Between Revisions 2.0 and 3.0
Starting at the third paragraph and throughout the document, replaced:
• kilobytes with KB
• megabytes with MB
• Changed WE[0:1]/BE[0:1] to WE/BE[0:1].
• First paragraph, text changed from “ based on the PowerPC Book E architecture” to “built on the Power
• Second paragraph: Changed terminology from PowerPC Book E architecture to Power Architecture terminology.
• Put overbars on the following signals: BDIP, OE, TA, TS, TEA
• Added the sentence directly preceding
• First paragraph, text changed from “ based on the PowerPC Book E architecture” to “built on the Power
• Second paragraph: Changed terminology from PowerPC Book E architecture to Power Architecture terminology.
Architecture embedded technology.”
from T
Architecture embedded technology.”
Section 3.7.1, “Input Value of Pins During POR Dependent on
Section 3.7.2, “Power-Up Sequence (VRC33
Section 3.7.3, “Power-Down Sequence (VRC33
L
to T
Reordered sections resulting in the following order and section renumbering:
H
Table 32. Global and Text Changes Between Rev. 2.0 and 3.0
.’
MPC5553 Microcontroller Data Sheet, Rev. 3.0
Table
Description of Change
1: ‘Unless noted in this data sheet, all specifications apply
Grounded),” then
Grounded).
VDD33,” then
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