EM35X-DEV-UPG-IAR Ember, EM35X-DEV-UPG-IAR Datasheet - Page 229

• Manufacturer Part Number: EM35X-DEV-UPG-IAR
• Description: IAR EWARM LICENCE FOR EM35X
• Manufacturer: Ember
• Type: Licenser

Specifications of EM35X-DEV-UPG-IAR

• For Use With/related Products: EM35x
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 636-1028

19.2 Solder Temperature Profile
Figure 19-5 illustrates the solder temperature profile for the EM35x. This temperature profile is similar for
other RoHS compliant packages, but manufacturing lines should be programmed with this profile in order to
guarantee proper solder connection to the PCB.
Table 19-1 contains the temperature profile parameters.
Average Ramp Up Rate (from Tsoak
Maximum Soak Temperature (Tsoak
Minimum Soak Temperature (Tsoak
Time within 5°C of Tpeak
Time from 25°C to Tpeak
Ramp Down Rate
Time above TL
Parameter
Tpeak
Table 19-1. Solder Reflow Parameters
TL
Figure 19-5. EM35x Reflow Profile
Final
19-3
max
to Tpeak)
min
max
)
)
EM351 / EM357
3°C per second max
6°C per second max
60 – 150 seconds
20 – 40 seconds
8 minutes, max
260 + 0°C
Value
150°C
200°C
217°C
120-035X-000G