TLP227G-2(TP1,N,F) Toshiba, TLP227G-2(TP1,N,F) Datasheet - Page 16
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TLP227G-2(TP1,N,F)
Manufacturer Part Number
TLP227G-2(TP1,N,F)
Description
PHOTOCOUPLER RELAY SSR 8-SMD
Manufacturer
Toshiba
Series
TLP227G-2r
Specifications of TLP227G-2(TP1,N,F)
Circuit
DPST (2 Form A)
Output Type
AC, DC
On-state Resistance
35 Ohm
Load Current
120mA
Voltage - Input
1.15VDC
Voltage - Load
0 ~ 350 V
Mounting Type
Surface Mount
Termination Style
Gull Wing
Package / Case
8-SMD (300 mil)
Load Voltage Rating
350 V
Load Current Rating
0.1 A
Contact Form
2 Form A
Output Device
MOSFET
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP227G2NFTR
4
Darlington-Transistor-Output Photocouplers
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
TLP127
TLP371
TLP372
TLP373
TLP523
TLP523-2
TLP523-4
TLP570
TLP571
TLP572
TLP627
TLP627-2
TLP627-4
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
Selection Guide
(4)
(4)
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
16
16
1
1
Pin Configuration
8
1
8
1
15
15
2
2
6
1
6
1
6
1
6
1
6
1
6
1
14
14
3
3
4
1
6
1
4
1
7
2
7
2
13
13
4
4
5
2
5
2
5
2
5
2
5
2
2
12
12
5
5
6
3
6
3
3
2
: Design which meets safety standard/approval pending as of January 2011
4
3
3
2
11
11
6
6
4
3
4
3
4
3
4
3
4
3
4
3
10
10
7
7
5
4
5
4
9
8
9
8
Mini-flat
MFSOP6
High V
DIP6
High V
SEMKO-approved
Internal base
connection
DIP6
High V
SEMKO-approved
DIP6
High V
Long emitter-collector
distance
SEMKO-approved
DIP4
DIP8
Dual-channel version
of the TLP523
DIP16
4-channel version of
the TLP523
DIP6
High EMI immunity
DIP6
Internal base
connection
DIP6
Built-in R
DIP4
High V
SEMKO-approved
TST part recm’ed
DIP8
Dual-channel version
of the TLP627
SEMKO-approved
TST part recm’ed
DIP16
4-channel version of
the TLP627
CEO
CEO
CEO
CEO
CEO
Features
BE
: Approved (reinforced insulation)
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
Min
500
500
500
CTR (%)
@I
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
1 mA,
16
1.2 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
F
(3)
, V
CE
1.2 V
1.2 V
1.2 V
1.2 V
1.2 V
1.2 V
1.2 V
1.2 V
1.2 V
1.2 V
Max
1 V
1 V
1 V
V
CE (sat)
: Design which meets safety standard/approval pending as of January 2011
100 mA,
100 mA,
100 mA,
100 mA,
100 mA,
100 mA,
100 mA,
100 mA,
100 mA,
100 mA,
50 mA,
50 mA,
50 mA,
@I
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
10 mA
C
, I
F
300 V
300 V
300 V
300 V
300 V
300 V
300 V
V
35 V
35 V
55 V
55 V
55 V
55V
CEO
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
2500
5000
5000
5000
2500
2500
2500
2500
2500
2500
5000
5000
5000
BVs
UL/
/
/
/
/
/
/
/
/
/
C
/
/ –
/ –
/
UL
TÜV
Safety Standards
VDE
(1)
BSI
(2)
IEC