298D226X0010M2T Vishay, 298D226X0010M2T Datasheet - Page 5

• Manufacturer Part Number: 298D226X0010M2T
• Description: CAP TANT 22UF 10V 20% SMD
• Manufacturer: Vishay
• Series: MICROTAN™ 298Dr
• Type: Moldedr

Specifications of 298D226X0010M2T

• Capacitance: 22µF
• Voltage - Rated: 10V
• Tolerance: ±20%
• Esr (equivalent Series Resistance): 10.00 Ohm
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.033" W (1.60mm x 0.85mm)
• Height: 0.032" (0.80mm)
• Manufacturer Size Code: M
• Features: General Purpose
• Voltage Rating: 10 Volts
• Esr: 10 Ohms
• Operating Temperature Range: - 55 C to + 85 C
• Dimensions: 0.85 mm W x 1.6 mm L
• Mfr Case Code: M Case
• Product: Tantalum Solid Standard Grade - Other Various
• Dissipation Factor Df: 40
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Lead Free Status / Rohs Status: Details
• Other names: 718-1718-2

298D
Vishay Sprague
www.vishay.com
42
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
Life Test at + 85 °C
Humidity Tests
Thermal Shock
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
Terminal Strength
Substrate Bending
(Board flex)
Vibration
Shock
Resistance to Solder
Heat
Solderability
Resistance to
Solvents
Flammability
CONDITION
1000 h application of rated voltage at
85 °C with a 3  series resistance,
MIL-STD-202G method 108A
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD-202G method 103B
At - 55 °C/+ 125 °C, 30 min each,
for 5 cycles. MIL-STD-202G method 107G
CONDITION
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
AEC Q-200 rev. C method 006
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AEC-Q200 rev. C method 005
MIL-STD-202G, method 204D,
10 Hz to 2000 Hz, 20 g peak
MIL-STD-202G, method 213B, Condition I,
100 g peak
At 260 °C, for 10 s, reflow
MIL-STD-202G, method 208H, ANSI/J-STD-002,
Test B. Applies only to solder and tin plated
terminations. Does not apply to gold terminations.
MIL-STD-202, method 215D
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.
For technical questions, contact:
M
ICRO
Solid Tantalum Chip Capacitors
T
AN
TM
Leadframeless Molded
[e-mail]
POST TEST PERFORMANCE
Capacitance change
Dissipation factor
Leakage current
Capacitance change
Dissipation factor
Leakage current
Capacitance change
Dissipation factor
Leakage current
POST TEST PERFORMANCE
Capacitance change
Dissipation factor
Leakage current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Capacitance change
Dissipation factor
Leakage current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
There shall be no mechanical or visual damage to capacitors
post-conditioning.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Document Number: 40065
Revision: 15-Jan-11