PIC16F876-20I/SO Microchip Technology, PIC16F876-20I/SO Datasheet - Page 576

IC MCU FLASH 8KX14 EE 28SOIC

PIC16F876-20I/SO

Manufacturer Part Number
PIC16F876-20I/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876-20I/SO

Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
 Details

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F876-20I/SO
Manufacturer:
TEMIC
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Part Number:
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Manufacturer:
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PICmicro MID-RANGE MCU FAMILY
30.5
DS31030A-page 30-6
Device Current Specifications
I
taken with all I/O as inputs, either pulled high or low. That is, there are no floating inputs, nor are
any pins driving an output (with a load).
I
referred to as power-down current. These tests are taken with all I/O as inputs, either pulled high
or low. That is, there are no floating inputs, nor are any pins driving an output (with a load), weak
pull-ups are disabled.
A device may have certain features and modules that can operate while the device is in sleep
mode. Some on these modules are:
• Watchdog Timer (WDT)
• Brown-out Reset (BOR) circuitry
• Timer1
• Analog to Digital converter
• LCD module
• Comparators
• Voltage Reference
When all features are disabled, the device will consume the lowest possible current (the leakage
current). If any of these features are operating while the device is in sleep, a higher current will
occur. The difference between the lowest power mode (everything off) at only that one feature
enabled (such as the WDT) is what we call the Module Differential Current. If more then one
feature is enabled then the expected current can easily be calculated as: the base current (every-
thing disabled and in sleep mode) plus all Module Differential Currents (delta currents).
Example 30-1
WDT and Timer1 oscillator enabled.
Example 30-1:
DD
PD
Base Current
WDT Delta Current
Timer1 Delta Current
Total Sleep Current
is the current (I) that the device consumes when the device is in operating mode. This test is
is the current (I) that the device consumes when the device is in sleep mode (power-down),
shows an example of calculating the typical currents for a device at 5V, with the
I
PD
Calculations with WDT and Timer1 Oscillator Enabled (@ 5V)
14 nA
14 A
22 A
36 A
; Device leakage current
; 14 A - 14 nA = 14 A
; 22 A - 14 nA = 22 A
;
1997 Microchip Technology Inc.

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