PIC16F876-20I/SO Microchip Technology, PIC16F876-20I/SO Datasheet - Page 678

IC MCU FLASH 8KX14 EE 28SOIC

PIC16F876-20I/SO

Manufacturer Part Number
PIC16F876-20I/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876-20I/SO

Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
368Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
 Details

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Manufacturer
Quantity
Price
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PIC16F876-20I/SO
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PICmicro MID-RANGE MCU FAMILY
I
DS31035A-page 35-6
I
Inter-Integrated Circuit. This is a two wire communication interface. This feature is one of the
modes of the SSP module.
Indirect Addressing
When the Data Memory Address is not contained in the Instruction. The instruction operates on
the INDF address, which causes the Data Memory Address to be the value in the FSR register.
The execution of the instruction will always access the data at the address pointed to by the FSR
register.
Instruction Bus
The bus which is used to transfer instruction words from the program memory to the CPU.
Instruction Fetch
Due to the Harvard architecture, when one instruction is to be executed, the next location in pro-
gram memory is “fetched” and ready to be decoded as soon as the currently executing instruction
is completed.
Instruction cycle
The events for an instruction to execute. There are four events which can generally be described
as: Decode, Read, Execute, and Write. Not all events will be done by all instructions. To see the
operations during the instruction cycle, please look in the description of each instruction. Four
external clocks (Tosc) make one instruction cycle (T
Interrupt
A signal to the CPU that causes the program flow to be forced to the Interrupt Vector Address
(04h in program memory). Before the program flow is changed, the contents of the Program
Counter (PC) are forced onto the hardware stack, so that program execution may return to the
interrupted point.
INTRC
Internal Resistor-Capacitor (RC). Some devices have a device oscillator option that allows the
clock to come from an internal RC.
2
C
CY
).
1997 Microchip Technology Inc.

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