LPC2364FBD100,551 NXP Semiconductors, LPC2364FBD100,551 Datasheet - Page 31

IC ARM7 MCU FLASH 128K 100LQFP

LPC2364FBD100,551

Manufacturer Part Number
LPC2364FBD100,551
Description
IC ARM7 MCU FLASH 128K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2364FBD100,551

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
34 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1022 - BOARD SCKT ADAPTER FOR TFBGA100568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2622-1019 - BOARD FOR LPC2106 48-LQFP568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3995
935282463551
LPC2364FBD100-S

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NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
7.24.4.1 Idle mode
7.24.4.2 Sleep mode
7.24.4 Power control
When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of Reset, and
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down and Deep-power down
modes, any wake-up of the processor from Power-down mode makes use of the wake-up
Timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of V
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
The LPC2364/65/66/67/68 supports a variety of power control features. There are four
special modes of processor power reduction: Idle mode, Sleep mode, Power-down mode,
and Deep power-down mode. The CPU clock rate may also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This allows a trade-off of power versus processing speed based on application
requirements. In addition, Peripheral Power Control allows shutting down the clocks to
individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all
dynamic power use in any peripherals that are not required for the application. Each of the
peripherals has its own clock divider which provides even better power control.
The LPC2364/65/66/67/68 also implements a separate power domain in order to allow
turning off power to the bulk of the device while maintaining operation of the RTC and a
small SRAM, referred to as the battery RAM.
In Idle mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Idle mode and may generate
interrupts to cause the processor to resume execution. Idle mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
In Sleep mode, the oscillator is shut down and the chip receives no internal clocks. The
processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Sleep mode and the logic levels of chip pins remain static. The
output of the IRC is disabled but the IRC is not powered down for a fast wake-up later. The
32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
The Sleep mode can be terminated and normal operation resumed by either a Reset or
certain specific interrupts that are able to function without clocks. Since all dynamic
operation of the chip is suspended, Sleep mode reduces chip power consumption to a
very low value. The flash memory is left on in Sleep mode, allowing a very quick wake-up.
DD(3V3)
Rev. 06 — 1 February 2010
ramp (in the case of power on), the type of crystal and its
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
© NXP B.V. 2010. All rights reserved.
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