LPC2364FBD100,551 NXP Semiconductors, LPC2364FBD100,551 Datasheet - Page 33

IC ARM7 MCU FLASH 128K 100LQFP

LPC2364FBD100,551

Manufacturer Part Number
LPC2364FBD100,551
Description
IC ARM7 MCU FLASH 128K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2364FBD100,551

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
34 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1022 - BOARD SCKT ADAPTER FOR TFBGA100568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2622-1019 - BOARD FOR LPC2106 48-LQFP568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3995
935282463551
LPC2364FBD100-S

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NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
7.25.1 Reset
7.25.2 Brownout detection
7.25 System control
The first option assumes that power consumption is not a concern and the design ties the
V
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (V
a dedicated 3.3 V supply for the CPU (V
converter powered independently from the I/O pad ring enables shutting down of the I/O
pad power supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC and the battery RAM. These two functions
require a minimum of power to operate, which can be supplied by an external battery.
When the CPU and the rest of chip functions are stopped and power removed, the RTC
can supply an alarm output that may be used by external hardware to restore chip power
and resume operation.
Reset has four sources on the LPC2364/65/66/67/68: the RESET pin, the Watchdog
reset, power-on reset, and the BrownOut Detection (BOD) circuit. The RESET pin is a
Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating
voltage attains a usable level, starts the Wake-up timer (see description in
“Wake-up
de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash
controller has completed its initialization.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the Boot Block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
The LPC2364/65/66/67/68 includes 2-stage monitoring of the voltage on the
V
to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt
Enable Register in the VIC in order to cause a CPU interrupt; if not, software can monitor
the signal by reading a dedicated status register.
The second stage of low-voltage detection asserts Reset to inactivate the
LPC2364/65/66/67/68 when the voltage on the V
Reset prevents alteration of the flash as operation of the various elements of the chip
would otherwise become unreliable due to low voltage. The BOD circuit maintains this
reset down below 1 V, at which point the power-on reset circuitry maintains the overall
Reset.
Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly executed event
loop to sense the condition.
DD(3V3)
DD(DCDC)(3V3)
and V
timer”), causing reset to remain asserted until the external Reset is
DD(DCDC)(3V3)
pins. If this voltage falls below 2.95 V, the BOD asserts an interrupt signal
Rev. 06 — 1 February 2010
pins together. This approach requires only one 3.3 V power
DD(DCDC)(3V3)
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
DD(DCDC)(3V3)
). Having the on-chip DC-to-DC
pins falls below 2.65 V. This
© NXP B.V. 2010. All rights reserved.
Section 7.24.3
DD(3V3)
33 of 59
) and

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