C8051F040-GQ Silicon Laboratories Inc, C8051F040-GQ Datasheet - Page 94

• Manufacturer Part Number: C8051F040-GQ
• Description: IC 8051 MCU 64K FLASH 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F04xr

Specifications of C8051F040-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 64
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x8b, 13x12b; D/A 2x10b, 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: CAN/SMBus/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 64
• Number Of Timers: 5
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F040DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 8-bit or 13-ch x 12-bit
• On-chip Dac: 2-ch x 12-bit
• No. Of I/o's: 64
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 5
• Rohs Compliant: Yes
• Data Rom Size: 64 KB
• A/d Bit Size: 12 bit
• A/d Channels Available: 13
• Height: 1 mm
• Length: 14 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Width: 14 mm
• Package: 100TQFP
• Device Core: 8051
• Family Name: C8051F04x
• Maximum Speed: 25 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1205 - DEV KIT FOR F040/F041/F042/F043
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1204

C8051F040/1/2/3/4/5/6/7
7.2.3. Settling Time Requirements
A minimum tracking time is required before an accurate conversion can be performed. This tracking time is
determined by the ADC2 MUX resistance, the ADC2 sampling capacitance, any external source resis-
tance, and the accuracy required for the conversion. Figure 7.3 shows the equivalent ADC2 input circuit.
The required ADC2 settling time for a given settling accuracy (SA) may be approximated by Equation 7.1.
Note: An absolute minimum settling time of 0.8 µs required after any MUX selection. Note that in low-
power tracking mode, three SAR2 clocks are used for tracking at the start of every conversion. For most
applications, these three SAR2 clocks will meet the tracking requirements.
Where:
SA is the settling accuracy, given as a fraction of an LSB (for example, 0.25 to settle within 1/4 LSB)
t is the required settling time in seconds
R
n is the ADC resolution in bits (8).
94
TOTAL
is the sum of the ADC2 MUX resistance and any external source resistance.
Equation 7.1. ADC2 Settling Time Requirements
Figure 7.3. ADC2 Equivalent Input Circuit
AIN2.x
t
=
RC
ln
MUX Select
Input


= R
------ -
SA
2
n
MUX


Rev. 1.5

R
* C
MUX
R
SAMPLE
TOTAL
= 5k
C
SAMPLE
C
SAMPLE
= 10pF