C8051F060-GQ Silicon Laboratories Inc, C8051F060-GQ Datasheet - Page 192

• Manufacturer Part Number: C8051F060-GQ
• Description: IC 8051 MCU 64K FLASH 100TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F06xr

Specifications of C8051F060-GQ

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 59
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 2x16b, 8x10b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F0x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4.25 KB
• Interface Type: CAN/I2C/SMBus/SPI/UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 59
• Number Of Timers: 5
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F060DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 2-ch x 12-bit
• No. Of I/o's: 59
• Ram Memory Size: 4352Byte
• Cpu Speed: 25MHz
• No. Of Timers: 5
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1214 - DEV KIT FOR F060/F062/F063
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1213

C8051F060/1/2/3/4/5/6/7
17.5. Memory Mode Selection
The external data memory space can be configured in one of four modes, shown in Figure 17.5, based on
the EMIF Mode bits in the EMI0CF register (Figure 17.2). These modes are summarized below. More infor-
mation about the different modes can be found in
17.5.1. Internal XRAM Only
When EMI0CF.[3:2] are set to ‘00’, all MOVX instructions will target the internal XRAM space on the
device. Memory accesses to addresses beyond the populated space will wrap on 4 k byte boundaries. As
an example, the addresses 0x1000 and 0x2000 both evaluate to address 0x0000 in on-chip XRAM space.
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•
17.5.2. Split Mode without Bank Select
When EMI0CF.[3:2] are set to ‘01’, the XRAM memory map is split into two areas, on-chip space and off-
chip space.
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•
•
•
192
EMI0CF[3:2] = 00
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
On-Chip XRAM
8-bit MOVX operations use the contents of EMI0CN to determine the high-byte of the effective address
and R0 or R1 to determine the low-byte of the effective address.
16-bit MOVX operations use the contents of the 16-bit DPTR to determine the effective address.
Effective addresses below the 4 kB boundary will access on-chip XRAM space.
Effective addresses beyond the 4 kB boundary will access off-chip space.
8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is on-
chip or off-chip. However, in the “No Bank Select” mode, an 8-bit MOVX operation will not drive the
upper 8-bits A[15:8] of the Address Bus during an off-chip access. This allows the user to manipulate
the upper address bits at will by setting the Port state directly. This behavior is in contrast with “Split
Mode with Bank Select” described below. The lower 8-bits of the Address Bus A[7:0] are driven, deter-
mined by R0 or R1.
16-bit MOVX operations use the contents of DPTR to determine whether the memory access is on-
chip or off-chip, and unlike 8-bit MOVX operations, the full 16-bits of the Address Bus A[15:0] are
driven during the off-chip transaction.
0xFFFF
0x0000
EMI0CF[3:2] = 01
(No Bank Select)
On-Chip XRAM
Off-Chip
Memory
Figure 17.5. EMIF Operating Modes
0xFFFF
0x0000
Rev. 1.2
Section “17.6. Timing” on page
EMI0CF[3:2] = 10
On-Chip XRAM
(Bank Select)
Off-Chip
Memory
0xFFFF
0x0000
EMI0CF[3:2] = 11
194.
Off-Chip
Memory
0xFFFF
0x0000