PIC16F877-04E/PT Microchip Technology, PIC16F877-04E/PT Datasheet - Page 251

IC MCU FLASH 8KX14 EE 44TQFP

PIC16F877-04E/PT

Manufacturer Part Number
PIC16F877-04E/PT
Description
IC MCU FLASH 8KX14 EE 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F877-04E/PT

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16F87704E/PT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F877-04E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
SPI is a trademark of Motorola Corporation.
I
M
2
C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 16. Basic Sychronous Serial Port (BSSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
16.1 Introduction ..................................................................................................................16-2
16.2 Control Registers .........................................................................................................16-3
16.3 SPI™ Mode..................................................................................................................16-6
16.4 SSP I
16.5 Initialization ................................................................................................................16-23
16.6 Design Tips ................................................................................................................16-24
16.7 Related Application Notes..........................................................................................16-25
16.8 Revision History .........................................................................................................16-26
Note:
Please refer to
use this module.
2
C Operation .....................................................................................................16-15
Appendix C.2
or the device data sheet to determine which devices
DS31016A page 16-1
16

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