MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 275

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

A.9.1
Freescale Semiconductor
Oscillator crystal or resonator (REFS = 1)
Input clock frequency (CLKS = 11, REFS = 0)
Input clock frequency (CLKS = 10, REFS = 0)
Internal reference frequency (untrimmed)
Duty cycle of input clock
Output clock ICGOUT frequency
Minimum DCO clock (ICGDCLK) frequency
Maximum DCO clock (ICGDCLK) frequency
Self-clock mode (ICGOUT) frequency
Self-clock mode reset (ICGOUT) frequency
Loss of reference frequency
Loss of DCO frequency
Crystal start-up time
FLL lock time
FLL frequency unlock range
FLL frequency lock range
ICGOUT period jitter,
Internal oscillator deviation from trimmed frequency
Oscillator Amplitude (peak-to-peak)
(Fundamental mode crystal or ceramic resonator)
Low range
High range
Low range
High range
CLKS = 10, REFS = 0
All other cases
Low range
High range
Low range
High range
Low range
High range
Long term jitter (averaged over 2 ms interval)
V
V
HGO = 0
HGO = 1
High Gain, FBE (HGO=1,CLKS = 10)
High Gain, FEE (HGO=1,CLKS = 11)
Low Power, FBE (HGO=0, CLKS=10)
Low Power, FEE (HGO=0, CLKS=11)
DD
DD
= 1.8 – 3.6 V, (constant temperature)
= 3.0 V ±10%, –40° C to 125° C
ICG Frequency Specifications
(V
4, 6
DDA
Characteristic
= V
4, 5
4, 7
3
4
DDA
measured at f
(REFS = 0)
2
(min) to V
Table A-11. ICG Frequency Specifications
1
ICGOUT
MC9S08GT16A/GT8A Data Sheet, Rev. 1
DDA
(max), Temperature Range = –40 to 125°C Ambient)
Max
8
f
f
ICGDCLKmax
ICGDCLKmin
f
f
Symbol
ICGIRCLK
f
V
fhi_eng
flp_eng
Self_reset
fhi_byp
flp_byp
n
ACC
ICGOUT
f
t
t
C
t
n
oscamp
hi_eng
t
f
CSTH
f
f
CSTL
Lockh
Unlock
f
Lockl
Extal
LOR
LOD
flo
t
Self
Lock
f
Jitter
dc
lo
int
f
f
ICGDCLKmin
Extal
f
182.25
lo
–4*N
–2*N
Min
5.5
0.5
32
32
40
(min)
50
—
—
—
—
—
—
—
—
—
1
2
1
2
2
0
8
5
(min)
Typical
± 0.5
±0.5
V
243
430
—
—
—
—
—
—
—
—
—
—
—
8
4
1
DD
f
f
f
ICGDCLKmax
ICGDCLKmax
Extal
Electrical Characteristics
303.75
(max)
Max
10.5
100
100
500
4*N
2*N
1.5
0.2
16
10
10
40
60
40
25
±2
±2
—
—
—
—
8
8
5
5
(max)
counts
counts
% f
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
Unit
kHz
kHz
kHz
kHz
ms
ms
%
%
V
ICG
275