MCF5274CVM166 Freescale Semiconductor, MCF5274CVM166 Datasheet - Page 43

• Manufacturer Part Number: MCF5274CVM166
• Description: IC MPU 32BIT 166MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5274CVM166

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 256
• Operating Temperature Range: -40°C To +85°C
• Processor Type: 68K/ColdFire V2
• Rohs Compliant: Yes
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 166MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

9
Documentation regarding the MCF5275 and their development support tools is available from a local
Freescale distributor, a Freescale semiconductor sales office, the Freescale Literature Distribution Center,
or through the Freescale web address at http://www.freescale.com/coldfire.
10
Table 29
Freescale Semiconductor
Rev. No.
1.1
1.2
1.3
0
1
2
3
4
provides a revision history for this hardware specification.
Documentation
Revision History
Initial release.
Added
Removed duplicate information in the module description sections. The information is all in the Signals
Removed Overview, Features, Signal Descriptions, Modes of Operation, and Address Multiplexing sections. This
Removed list of documentation in
Changed CLKOUT -> PSTCLK in
Table
Table
Added
Added thermal characteristics for 196 MAPBGA in
Updated package dimensions drawing,
Removed second sentence from
Removed third and fourth paragraphs from
Corrected Ordering Information,
Figure
Table
Table
Description Table.
information can be found in the MCF5275 Reference Manual.
site.
B6a, B6b, B6c maximum changed from “0.5t
B7, B7a minimum changed from “0.5t
B9, B11 minimum changed from “1.5” to “1.0”
FECn_RXER, and
FECn_TXEN, FECn_TXER,
FECn_TXEN, FECn_TXER,
10: Update V
13: Timings B6a, B6b, B6c, B7, B7a, B9, B12 updated:
10: Corrected maximum “Input High Voltage 3.3V I/O Pads”, V
10, added PLL supply voltage row
2: Moved PLLV
Figure
Section 5.2.1, “Supply Voltage Sequencing and Separation
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
6.
DD
FECn_RXCLK),”
DD
spec from 1.35-1.65 to 1.4-1.6.
from 1.5V to 3.3V supply line and corrected relevant text in sections below table.
Table 29. Document Revision History
FECn_TXCLK),”
FECn_TXCLK),”
Table
Section 8.11.1, “MII Receive Signal Timing (FECn_RXD[3:0], FECn_RXDV,
Section 9,
Section 8.16, “Debug AC Timing
6.
and
Figure
CYC
Substantive Change(s)
Section 8.11.2, “MII Transmit Signal Timing (FECn_TXD[3:0],
Section 8.11.2, “MII Transmit Signal Timing (FECn_TXD[3:0],
“Documentation.”. An up-to-date list is always available on our web
+ 1.5” to “0.5t
6.
CYC
regarding no minimum frequency requirement for TXCLK.
as this feature is not supported on this device.
Table
+ 5” to “0.5t
8.
CYC
+ 1.0”
CYC
Cautions.”
Specifications.”
+ 5.5”
IH
specification.
Documentation
43