LFXP3C-3TN144C Lattice, LFXP3C-3TN144C Datasheet - Page 4

• Manufacturer Part Number: LFXP3C-3TN144C
• Description: FPGA - Field Programmable Gate Array 3.1K LUTS 100 I/O
• Manufacturer: Lattice

Specifications of LFXP3C-3TN144C

• Number Of Programmable I/os: 100
• Data Ram Size: 55296
• Supply Voltage (max): 3.465 V
• Maximum Operating Temperature: + 90 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.71 V
• Package / Case: TQFP-144
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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July 2007
Architecture Overview
The LatticeXP architecture contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Inter-
spersed between the rows of logic blocks are rows of sysMEM Embedded Block RAM (EBR) as shown in Figure 2-
1.
On the left and right sides of the PFU array, there are Non-volatile Memory Blocks. In configuration mode this non-
volatile memory is programmed via the IEEE 1149.1 TAP port or the sysCONFIG™ peripheral port. On power up,
the configuration data is transferred from the Non-volatile Memory Blocks to the configuration SRAM. With this
technology, expensive external configuration memories are not required and designs are secured from unauthor-
ized read-back. This transfer of data from non-volatile memory to configuration SRAM via wide busses happens in
microseconds, providing an “instant-on” capability that allows easy interfacing in many applications.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and Programmable Functional unit
without RAM/ROM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM, ROM and register func-
tions. The PFF block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF blocks
are optimized for flexibility, allowing complex designs to be implemented quickly and efficiently. Logic Blocks are
arranged in a two-dimensional array. Only one type of block is used per row. The PFU blocks are used on the out-
side rows. The rest of the core consists of rows of PFF blocks interspersed with rows of PFU blocks. For every
three rows of PFF blocks there is a row of PFU blocks.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysIO interfaces. PIO pairs on the left and
right edges of the device can be configured as LVDS transmit/receive pairs. sysMEM EBRs are large dedicated fast
memory blocks. They can be configured as RAM or ROM.
The PFU, PFF, PIC and EBR Blocks are arranged in a two-dimensional grid with rows and columns as shown in
Figure 2-1. The blocks are connected with many vertical and horizontal routing channel resources. The place and
route software tool automatically allocates these routing resources.
At the end of the rows containing the sysMEM Blocks are the sysCLOCK Phase Locked Loop (PLL) Blocks. These
PLLs have multiply, divide and phase shifting capability; they are used to manage the phase relationship of the
clocks. The LatticeXP architecture provides up to four PLLs per device.
Every device in the family has a JTAG Port with internal Logic Analyzer (ispTRACY) capability. The sysCONFIG
port which allows for serial or parallel device configuration. The LatticeXP devices are available for operation from
3.3V, 2.5V, 1.8V and 1.2V power supplies, providing easy integration into the overall system.
LatticeXP Family Data Sheet
2-1
Architecture
DS1001
Data Sheet DS1001
Architecture_02.0