BUK625R0-40C,118 NXP Semiconductors, BUK625R0-40C,118 Datasheet - Page 6

• Manufacturer Part Number: BUK625R0-40C,118
• Description: MOSFET N-CH TRENCH DPAK
• Manufacturer: NXP Semiconductors
• Series: TrenchMOS™r

Specifications of BUK625R0-40C,118

• Input Capacitance (ciss) @ Vds: 5200pF @ 25V
• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 5 mOhm @ 25A, 10V
• Drain To Source Voltage (vdss): 40V
• Current - Continuous Drain (id) @ 25° C: 90A
• Vgs(th) (max) @ Id: 2.8V @ 1mA
• Gate Charge (qg) @ Vgs: 88nC @ 10V
• Power - Max: 158W
• Mounting Type: Surface Mount
• Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 5 mOhms
• Drain-source Breakdown Voltage: 40 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 90 A
• Power Dissipation: 158 W
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS compliant by exemption

NXP Semiconductors
6. Characteristics
Table 6.
BUK625R0-40C
Product data sheet
Symbol
Static characteristics
V
V
I
I
R
Dynamic characteristics
Q
Q
Q
C
C
C
t
t
t
t
L
L
DSS
GSS
d(on)
r
d(off)
f
D
S
(BR)DSS
GS(th)
DSon
iss
oss
rss
G(tot)
GS
GD
Characteristics
Parameter
drain-source
breakdown voltage
gate-source threshold
voltage
drain leakage current
gate leakage current
drain-source on-state
resistance
total gate charge
gate-source charge
gate-drain charge
input capacitance
output capacitance
reverse transfer
capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain
inductance
internal source
inductance
Conditions
I
I
I
see
I
see
I
see
V
V
V
V
V
see
V
see
V
see
V
see
I
see
I
see
I
see
V
T
V
R
from upper edge of drain mounting base
to centre of die ; T
from source lead to source bond pad ;
T
All information provided in this document is subject to legal disclaimers.
D
D
D
D
D
D
D
D
j
j
DS
DS
DS
DS
GS
GS
GS
GS
GS
DS
G(ext)
= 25 °C; see
= 25 °C
= 250 µA; V
= 250 µA; V
= 1 mA; V
= 1 mA; V
= 1 mA; V
= 25 A; V
= 25 A; V
= 25 A; V
Figure
Figure 9
Figure 9
Figure 11
Figure 11
Figure 11
Figure
Figure
Figure
Figure
= 40 V; V
= 40 V; V
= 0 V; V
= 0 V; V
= 30 V; R
= 10 V; I
= 5 V; I
= 4.5 V; I
= 10 V; I
= 0 V; V
Rev. 1 — 17 September 2010
= 10 Ω
9; see
12; see
13; see
13; see
13; see
D
DS
DS
DS
DS
DS
DS
GS
GS
DS
D
D
= 25 A; T
D
GS
GS
L
GS
GS
= 25 A; T
= 25 A; T
= 32 V; V
= 32 V; V
= 32 V; V
= V
= V
= V
= 25 A; T
Figure 15
= 1.2 Ω; V
= 20 V; T
= -20 V; T
= 25 V; f = 1 MHz;
= 0 V; T
= 0 V; T
= 0 V; T
= 0 V; T
Figure 10
j
GS
GS
GS
= 25 °C
Figure 11
Figure 14
Figure 14
Figure 14
; T
; T
; T
j
= 25 °C;
j
j
j
j
j
GS
GS
GS
j
j
j
j
= 25 °C;
= -55 °C;
= 175 °C;
= 25 °C;
= 175 °C;
j
j
j
= 25 °C;
GS
= 25 °C
= 175 °C
= 25 °C
= 25 °C
= -55 °C
= 25 °C
= 10 V;
= 5 V;
= 10 V;
N-channel TrenchMOS intermediate level FET
= 10 V;
BUK625R0-40C
Min
40
36
1.8
-
0.8
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ
-
-
2.3
-
-
0.02
-
2
2
4.1
5.5
6.2
-
88
50.5
14.6
25.9
3900
512
350
23
52
164
77
3.5
7.5
© NXP B.V. 2010. All rights reserved.
-
614
-
Max
-
-
2.8
3.3
-
1
500
100
100
5
6.9
8.3
10.1
-
-
-
5200
480
-
-
-
-
-
Unit
V
V
V
V
V
µA
µA
nA
nA
mΩ
mΩ
mΩ
mΩ
nC
nC
nC
nC
pF
pF
pF
ns
ns
ns
ns
nH
nH
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