AUIRF7675M2TR1 International Rectifier, AUIRF7675M2TR1 Datasheet - Page 2

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AUIRF7675M2TR1

Manufacturer Part Number
AUIRF7675M2TR1
Description
MOSFET N-CH 150V 90A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of AUIRF7675M2TR1

Input Capacitance (ciss) @ Vds
1360pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
56 mOhm @ 11A, 10V
Drain To Source Voltage (vdss)
150V
Current - Continuous Drain (id) @ 25° C
90A
Vgs(th) (max) @ Id
5V @ 100µA
Gate Charge (qg) @ Vgs
32nC @ 10V
Power - Max
2.7W
Mounting Type
*
Package / Case
*
Continuous Drain Current Id
4.4A
Drain Source Voltage Vds
150V
On Resistance Rds(on)
0.047ohm
Rds(on) Test Voltage Vgs
10V
Transistor Case Style
DirectFET M2
No. Of Pins
3
Svhc
No SVHC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ƒ Surface mounted on 1 in. square Cu
Notes  through Š are on page 10
ΔΒV
ΔV
Static @ T
BV
R
V
gfs
R
I
I
Dynamic Characteristics @ T
Q
Q
Q
t
t
t
t
C
C
C
C
C
Diode Characteristics @ T
I
I
V
t
Q
DSS
GSS
d(on)
r
d(off)
f
S
SM
rr
(still air).
GS(th)
SD
DS(on)
G
g
Q
Q
Q
Q
sw
oss
iss
oss
rss
oss
oss
rr
2
GS(th)
DSS
gs1
gs2
gd
godr
DSS
/ΔT
/ΔT
J
J
J
= 25°C (unless otherwise specified)
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Forward Transconductance
Gate Resistance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Q
Output Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Parameter
Parameter
g
J
gs2
= 25°C (unless otherwise stated)
+ Q
J
= 25°C (unless otherwise stated)
gd
)
clip heatsink (still air)
Min. Typ. Max. Units
Min. Typ. Max. Units
150
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
3.0
16
1360
1210
0.16
–––
–––
–––
–––
–––
–––
190
–––
–––
–––
180
-11
4.0
1.2
5.2
1.6
7.1
7.1
8.7
8.8
7.5
47
21
10
13
14
41
92
63
with small
-100
–––
–––
–––
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
270
5.0
5.0
1.3
56
20
32
18
72
95
mV/°C
V/°C
nC
nC
nC
μA
nA
pF
ns
ns
V
V
S
Ω
A
V
board with metalized back and with small
clip heatsink (still air)
‰ Mounted on minimum footprint full size
V
Reference to 25°C, I
V
V
V
V
V
V
V
V
V
I
See Fig. 6 and 17
V
V
I
R
V
V
ƒ = 1.0MHz
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/μs
D
D
J
J
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DS
DD
GS
DS
GS
GS
G
= 11A
= 11A
=6.8Ω
= 25°C, I
= 25°C, I
= V
= 50V, I
= 150V, V
= 150V, V
= 75V
= 16V, V
= 25V
= 0V, I
= 10V, I
= 20V
= -20V
= 10V
= 75V, V
= 0V
= 0V, V
= 0V, V
GS
, I
D
Conditions
D
DS
DS
Conditions
S
F
D
D
= 250μA
GS
GS
= 11A, V
= 11A, V
= 100μA
= 11A
= 11A
GS
GS
= 1.0V, f=1.0MHz
= 120V, f=1.0MHz
= 0V
= 10V
i
= 0V
= 0V, T
i
D
www.irf.com
DD
GS
= 1mA
i
J
= 0V
= 25V
G
= 125°C
i
D
S

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