PCA9601DP,118 NXP Semiconductors, PCA9601DP,118 Datasheet - Page 28

• Manufacturer Part Number: PCA9601DP,118
• Description: IC DUAL BI-DIR BUS BUFFER 8-TSSO
• Manufacturer: NXP Semiconductors

Specifications of PCA9601DP,118

• Number Of Channels Per Chip: 2
• Supply Voltage (max): 15 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-8
• Interface: I2C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5302-2

NXP Semiconductors
13. Abbreviations
14. Revision history
Table 11.
PCA9601_1
Product data sheet
Document ID
PCA9601_1
Revision history
Release date
20100528
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 10.
Acronym
CDM
ESD
HBM
I
I/O
IC
MM
PMBus
SCL
SDA
SMBus
TTL
2
Fig 29. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Data sheet status
Product data sheet
All information provided in this document is subject to legal disclaimers.
Description
Charged-Device Model
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Input/Output
Integrated Circuit
Machine Model
Power Management Bus
Serial Clock Line
Serial DAta line
System Management Bus
Transistor-Transistor Logic
Rev. 01 — 28 May 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
Dual bidirectional bus buffer
temperature
Supersedes
-
peak
PCA9601
© NXP B.V. 2010. All rights reserved.
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