PCA9601DP,118 NXP Semiconductors, PCA9601DP,118 Datasheet - Page 31

• Manufacturer Part Number: PCA9601DP,118
• Description: IC DUAL BI-DIR BUS BUFFER 8-TSSO
• Manufacturer: NXP Semiconductors

Specifications of PCA9601DP,118

• Number Of Channels Per Chip: 2
• Supply Voltage (max): 15 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-8
• Interface: I2C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5302-2

NXP Semiconductors
17. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.2
7.3
7.4
8
9
10
10.1
10.2
10.2.1
11
12
12.1
12.2
12.3
12.4
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24
Soldering of SMD packages . . . . . . . . . . . . . . 26
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 28
Legal information. . . . . . . . . . . . . . . . . . . . . . . 29
Contact information. . . . . . . . . . . . . . . . . . . . . 30
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Connections to other bus buffers . . . . . . . . . . . 5
Comparison of PCA9601/PCA9600 and
P82B96 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
minimum value . . . . . . . . . . . . . . . . . . . . . . . . 19
Wave and reflow soldering . . . . . . . . . . . . . . . 26
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Static level offset card side . . . . . . . . . . . . . . . . 4
Fast-mode operation . . . . . . . . . . . . . . . . . . . . 4
Fast-mode Plus operation . . . . . . . . . . . . . . . . 4
High drive, long distance side. . . . . . . . . . . . . . 5
Calculating system delays and bus clock
Negative undershoot below absolute
Example with questions and answers. . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 26
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 26
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 29
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Dual bidirectional bus buffer
Document identifier: PCA9601_1
PCA9601
Date of release: 28 May 2010
All rights reserved.