GS816032BGT-200 GSI TECHNOLOGY, GS816032BGT-200 Datasheet - Page 5

• Manufacturer Part Number: GS816032BGT-200
• Description: 18M SYNCH BURST SRAM 512KX32, SMD
• Manufacturer: GSI TECHNOLOGY

Specifications of GS816032BGT-200

• Memory Size: 18Mbit
• Clock Frequency: 200MHz
• Access Time: 6.5ns
• Supply Voltage Range: 2.3V To 2.7V, 3V To 3.6V
• Memory Case Style: TQFP
• No. Of Pins: 100
• Operating Temperature Range: 0°C To +70°C
• Memory Configuration: 512K X 32
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TQFP Pin Description
Rev: 1.03 9/2005
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
B
ADSP, ADSC
A
Symbol
, B
A
E
V
ADV
DQ
DQ
DQ
DQ
LBO
V
GW
V
BW
0
NC
B,
CK
1
ZZ
E
FT
DDQ
G
A
, A
, E
DD
SS
B
2
A
B
C
D
C
1
3
, B
D
Type
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
5/24
Address Strobe (Processor, Cache Controller); active low
Address field LSBs and Address Counter preset Inputs
Byte Write Enable for DQ
Burst address counter advance enable; active low
Global Write Enable—Writes all bytes; active low
Byte Write—Writes all enabled bytes; active low
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
Sleep Mode control; active high
Clock Input Signal; active high
Data Input and Output pins
Output driver power supply
Output Enable; active low
Chip Enable; active high
Chip Enable; active low
I/O and Core Ground
Core power supply
Address Inputs
Description
No Connect
A
, DQ
B
GS816018/32/36BT-250/200/150
Data I/Os; active low
© 2004, GSI Technology