HSDL-3208-021 Lite-On Electronics, HSDL-3208-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3208-021
• Description: Infrared Transceivers IR Transceiver 115Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3208-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Radiant Intensity: 8 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 50 ns, 600 ns
• Maximum Fall Time: 50 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 7.4 mm x 2.9 mm x 1.8 mm
• Data Rate: 115.2Kbps
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Fall Time: 600/50ns
• Rise Time: 600/50ns
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 7
• Operating Temp Range: -25C to 70C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 100µA
• Link Range, Low Power: 30cm
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 7mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The reflow profile is a straight-
line representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each
with different T/ time tempera-
ture change rates. The T/ time
rates are detailed in the above
table. The temperatures are
measured at the component to
printed circuit board connections.
In process zone P1, the PC
board and HSDL-3208 castella-
tion I/O pins are heated to a
temperature of 160 C to activate
the flux in the solder paste. The
temperature ramp up rate, R1, is
limited to 4 C per second to allow
for even heating of both the PC
board and HSDL-3208
castellation I/O pins.
12
Recommended Reflow Profile
Figure 17. Reflow graph.
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
255
230
220
200
180
160
120
80
25
0
HEAT
R1
UP
P1
50
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
SOLDER PASTE DRY
R2
P2
100
t-TIME (SECONDS)
Process zone P2 should be of
sufficient time duration (60 to
120 seconds) to dry the solder
paste. The temperature is raised
to a level just below the liquidus
point of the solder, usually 200 C
(392 F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 255 C (491 F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 20 and 60 seconds. It
usually takes about 20 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 60 seconds, the intermetallic
growth within the solder
25 C to 160 C
160 C to 200 C
200 C to 255 C (260 C at 10 seconds max.)
255 C to 200 C
200 C to 25 C
T
150
R3
MAX. 260°C
REFLOW
SOLDER
60 sec.
ABOVE
220°C
MAX.
P3
200
R4
DOWN
COOL
P4
R5
250
300
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 200 C (392 F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The
cool down rate, R5, from the
liquidus point of the solder to
25 C (77 F) should not exceed
6 C per second maximum. This
limitation is necessary to allow
the PC board and HSDL-3208
castellation I/O pins to change
dimensions evenly, putting
minimal stresses on the HSDL-
3208 transceiver.
Maximum T/ time
4 C/s
0.5 C/s
–6 C/s
–6 C/s
4 C/s