HSEC8-150-01-H-DV-A Samtec Inc, HSEC8-150-01-H-DV-A Datasheet
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HSEC8-150-01-H-DV-A
Manufacturer Part Number
HSEC8-150-01-H-DV-A
Description
Manufacturer
Samtec Inc
Type
Card Edger
Datasheet
1.HSEC8-150-01-H-DV-A.pdf
(1 pages)
Specifications of HSEC8-150-01-H-DV-A
Number Of Contacts
100POS
Number Of Contact Rows
2
Body Orientation
Straight
Card Thickness (mm)
1.6mm
Contact Plating
Gold Over Nickel
Contact Material
Beryllium Copper
Termination Method
Solder
Mounting Style
Surface Mount
Product Height (mm)
7.98mm
Operating Temp Range
-55C to 125C
Pitch (mm)
0.8mm
Housing Material
Liquid Cryst Polymer
Housing Color
Black
Current Rating (max)
3.1A
Lead Free Status / RoHS Status
Compliant
0,80
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HSEC8-DV
Insulator Material:
Black Liquid
Crystal Polymer
Contact: BeCu
Plating:
Au or Sn over 50µ"
(1,27µm) Ni
Current Rating:
3.1A @ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15mm) .125" nominal
RoHS Compliant: Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (10-60)
Note: Other Gold plating
options available.
Contact Samtec.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
F-209-2
SPECIFIC OPTION
• Custom cards for low-cost
• Samtec supplied card
• Specialty
SPECIFICATIONS
• Standard high speed
CUSTOM CARDS
interface cards for 19mm,
25mm & 30mm mated
heights, single-ended &
differential applications.
See HSC8 Series.
stack height customization
layout/artwork to make
your own
cards
card
shapes
APPLICATION
STANDARD &
AVAILABLE
Guide Rails.
Call Samtec.
mm
Mates with:
1,6mm thick cards,
EEDP, HSC8, HSF8
HI-SPEED SOCKET
HSEC8
0,80mm HSEC8
7,98mm Stack Height
Single-Ended Signaling
Differential Pair Signaling
For complete test data go to www.samtec.com?HSEC8
or contact sig@samtec.com
(7,80)
.307
(1,75)
(1,50)
.069
.059
02
01
10, 13, 20, 25, 30, 37,
No. of Positions x (0,80) .0315 + (4,60) .181
01
02
No. of Positions x (0,80) .0315 + (7,80) .307
40, 49, 50, 60
A
(0,80) .0315 + (2,20) .087
No. of Positions x
10, 20 & 30
1
POSITIONS
Rated @ -3dB Insertion Loss
PER ROW
(1,12) .044 DIA
(0,80) .0315
B
10.5 GHz / 21 Gbps
8 GHz / 16 Gbps
WWW.SAMTEC.COM
WWW.SAMTEC.COM
™
®
HSEC8–160–01–S–DV–A
(7,98)
(5,60)
.314
.220
THICKNESS
= (1,60mm) .062"
thick card
CARD
(7,00)
.276
–01
(7,98)
POSITIONS
.314
(4,22)
*
PER ROW
.166
Mates with EEDP Series.
Positions where no dimensions are given
do not have keying feature.
13*
25*
37*
40
49*
50
60
PLATING
OPTION
= 30µ" (0,76µm) Gold on contact,
(26,90) 1.059
(18,10) .713
(18,90) .744
(22,90) .902
(22,90) .902
Alignment
Pins
(6,10) .240
(6,10) .240
–BL
A
Matte Tin on tail
–S
(34,20) 1.346
(36,60) 1.441
(43,80) 1.724
(44,60) 1.756
(52,60) 2.071
(15,00) .591
(24,60) .969
HSEC8–130–01–S–DV–A
HIGH SPEED CABLE &
–EM to –DV
FLEX APPLICATIONS
DV
B
HSEC8
SERIES
BOARD-TO-BOARD
APPLICATIONS
–DV to HSF8
–L
CONNECTOR CABLE*
–DV to EEDP
HSEC8–113
HSEC8–125
HSEC8–137
HSEC8–149
–DV to –DV
A
with EEDP.)
OPTION
= (5,50mm)
OTHER
Packaging
= Latching
(13, 25, 37,
Place Pad
Polyimide
PCB to –DV
.217" DIA
= Tape &
(For use
49 only)
60 only)
= Board
EEDP–08
EEDP–16
EEDP–24
EEDP–32
–TR
Option
–BL
(40, 50,
Pick &
Locks
–K
Reel
Film
–L