IRF840A Vishay, IRF840A Datasheet - Page 2

MOSFET N-CH 500V 8A TO-220AB

IRF840A

Manufacturer Part Number
IRF840A
Description
MOSFET N-CH 500V 8A TO-220AB
Manufacturer
Vishay
Datasheets

Specifications of IRF840A

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
850 mOhm @ 4.8A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
8A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
38nC @ 10V
Input Capacitance (ciss) @ Vds
1018pF @ 25V
Power - Max
125W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.85 Ohms
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
30 V
Continuous Drain Current
8 A
Power Dissipation
125 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF840A

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Avalanche Characteristics
Thermal Resistance
Diode Characteristics
Dynamic @ T
Static @ T
E
I
E
R
R
R
R
g
Q
Q
Q
t
t
t
t
C
C
C
C
C
C
I
I
V
t
Q
t
V
∆V
V
I
I
AR
S
on
DSS
GSS
d(on)
d(off)
f
SM
r
rr
AS
AR
fs
θJC
θCS
θJA
DS(on)
SD
(BR)DSS
GS(th)
iss
oss
rss
oss
oss
oss
g
gs
gd
rr
(BR)DSS
2
eff.
/∆T
J
Breakdown Voltage Temp. Coefficient
Effective Output Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Drain-to-Source Breakdown Voltage
Static Drain-to-Source On-Resistance –––
Gate Threshold Voltage
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
J
= 25°C (unless otherwise specified)
J
= 25°C (unless otherwise specified)
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
Parameter
Parameter
Parameter
–––
500
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Min. Typ. Max. Units
Min. Typ. Max. Units
Min. Typ. Max. Units
3.7
2.0
–––
–––
–––
–––
––– 2.16 3.24
Intrinsic turn-on time is negligible (turn-on is dominated by L
1018 –––
1490 –––
0.58
–––
–––
–––
–––
–––
–––
–––
–––
155
–––
–––
–––
422
––– 0.85
–––
––– -100
8.0
11
23
26
19
42
56
–––
633
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
2.0
4.0
9.0
8.0
38
18
25
32
–––
µC
nC
ns
pF
µA
nA
ns
V/°C
S
V
V
V
Typ.
Typ.
0.50
–––
–––
–––
–––
ƒ = 1.0MHz, See Fig. 5
V
V
I
V
V
V
I
R
R
V
V
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs „
V
V
V
V
V
V
D
D
J
J
GS
Reference to 25°C, I
GS
DS
DS
DS
GS
GS
DS
DS
GS
DD
GS
DS
GS
GS
GS
G
D
= 8.0A
= 8.0A
= 25°C, I
= 25°C, I
= 9.1Ω
= 31Ω,See Fig. 10
= 50V, I
= 400V
= 0V
= 25V
= 0V, I
= 10V, I
= V
= 500V, V
= 400V, V
= 30V
= -30V
= 10V, See Fig. 6 and 13 „
= 250V
= 0V, V
= 0V, V
= 0V, V
GS
, I
D
S
F
DS
D
D
D
DS
DS
= 250µA
Conditions
= 8.0A, V
= 8.0A
Conditions
Conditions
= 250µA
= 4.8A
= 4.8A „
GS
GS
= 0V to 400V …
Max.
Max.
= 1.0V, ƒ = 1.0MHz
= 400V, ƒ = 1.0MHz
510
–––
8.0
1.0
13
62
= 0V
= 0V, T
www.irf.com
D
GS
= 1mA
J
G
= 0V „
= 125°C
Units
Units
°C/W
S
mJ
mJ
+L
A
D
S
D
)

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