MT48LC4M16A2TG-75 IT:G TR Micron Technology Inc, MT48LC4M16A2TG-75 IT:G TR Datasheet - Page 60

• Manufacturer Part Number: MT48LC4M16A2TG-75 IT:G TR
• Description: DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II T/R
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC4M16A2TG-75 IT:G TR

• Package: 54TSOP-II
• Density: 64 Mb
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: -40 to 85 °C
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 64M (4M x 16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 54-TSOP II
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 557-1090-2

Figure 43:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
DQML, DQMU
A0–A9, A11
COMMAND
BA0, BA1
DQM /
CKE
A10
CLK
DQ
t CKS
t CMS
Single READ – With Auto Precharge
t AS
t AS
t AS
ACTIVE
ROW
ROW
T0
BANK
t CMH
t CKH
Notes:
t AH
t AH
t AH
t RCD
t RAS
t RC
t CK
T1
1. For this example, BL = 1, and CL = 2.
2. READ command not allowed or
3. x16: A8, A9 and A11 = “Don’t Care”
NOP
x8: A9 and A11 = “Don’t Care”
x4: A11 = “Don’t Care”
t CL
T2
NOP 2
t CH
T3
NOP 2
ENABLE AUTO PRECHARGE
t CMS
60
COLUMN m 3
BANK
T4
READ
t
RAS would be violated.
t CMH
CAS Latency
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T5
NOP
t AC
t RP
D
T6
OUT
NOP
64Mb: x4, x8, x16 SDRAM
t OH
m
t HZ
©2000 Micron Technology, Inc. All rights reserved.
ACTIVE
BANK
ROW
T7
ROW
Timing Diagrams
T8
NOP
DON’T CARE
UNDEFINED