MT48LC8M16A2TG-75:G Micron Technology Inc, MT48LC8M16A2TG-75:G Datasheet - Page 14

DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TSOP-II Tray

MT48LC8M16A2TG-75:G

Manufacturer Part Number
MT48LC8M16A2TG-75:G
Description
DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC8M16A2TG-75:G

Density
128 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-TSOP II
Organization
8Mx16
Address Bus
14b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Not Compliant, Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC8M16A2TG-75:G
Manufacturer:
MICRON
Quantity:
45
Part Number:
MT48LC8M16A2TG-75:G
Manufacturer:
MICRON
Quantity:
20 000
Table 4:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
54-Pin TSOP
5, 11, 44, 50
6, 12, 46, 52
2, 4, 5, 7, 8,
3, 9, 43, 49
10, 11, 13,
42, 44, 45,
47, 48, 50,
2, 5, 8, 11,
44, 47, 50,
28, 41, 54
1, 14, 27
51, 53
53
40
36
Pin/Ball Descriptions (Continued)
D2, D1, C2,
A8, B9, B8,
C9, C8, D9,
A7, B3, C7,
A3, B7, C3,
D8, E9, E1,
C1, B2, B1,
A9, E7, J9
A1, E3, J1
54-Ball
VFBGA
A2
G1
D3
D7
E2
A8, C7, D8,
G1, G2, G7,
G8, H1, H8,
B1, B8, D2,
D7, E1, E8,
F7, F2, D1,
J1, K1, K8,
B7, C1, E7,
B2, C8, E2,
A2, H2, R2
C7, F7, F2,
60-Ball
C2, A1
A7, R7
FBGA
C2
L7
L1
F1
F8
DQ0–DQ7
DQ0–DQ3
Symbol
DQ0–
DQ15
V
V
V
V
NC
NC
DD
SS
DD
SS
Q
Q
x16: I/O Data input/output: Data bus for x16 (pins 4, 7, 10, 13, 42,
Supply DQ power: Isolated DQ power on the die for improved
Supply DQ ground: Isolated DQ ground on the die for improved
Supply Power supply: +3.3 ±0.3V.
Supply Ground.
x8: I/O Data input/output: Data bus for x8 (pins 2, 8, 47, and 53
x4: I/O Data input/output: Data bus for x4.
Type
14
Description
45, 48, and 51 are NCs for x8; and 2, 4, 7, 8, 10, 13, 42, 45,
47, 48, 51, and 53 are NCs for x4).
are NCs for x4; balls A8, D8, D1, and A1 are NCs for x4).
No connect: These pins should be left unconnected.
Address input (A12) for the 256Mb and 512Mb devices.
noise immunity.
noise immunity.
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb: x4, x8, x16 SDRAM
Pin/Ball Descriptions
©1999 Micron Technology, Inc. All rights reserved.

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