PBLS2002S,115 NXP Semiconductors, PBLS2002S,115 Datasheet - Page 13

• Manufacturer Part Number: PBLS2002S,115
• Description: LOADSWITCH PNP 20V 3A 8-SOIC
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PBLS2002S,115

• Package / Case: 8-SOIC (3.9mm Width)
• Transistor Type: 1 NPN Pre-Biased, 1 PNP
• Current - Collector (ic) (max): 100mA, 3A
• Voltage - Collector Emitter Breakdown (max): 50V, 20V
• Resistor - Base (r1) (ohms): 4.7K
• Resistor - Emitter Base (r2) (ohms): 4.7K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V
• Vce Saturation (max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
• Current - Collector Cutoff (max): 1µA, 100nA
• Frequency - Transition: 100MHz
• Power - Max: 1.5W
• Mounting Type: Surface Mount
• Configuration: Dual Dual Collector
• Transistor Polarity: NPN/PNP
• Typical Input Resistor: 4.7 KOhms at NPN
• Typical Resistor Ratio: 1 at NPN
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 50 V at NPN, 20 V at PNP
• Peak Dc Collector Current: 100 mA at NPN, 3000 mA at PNP
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934060278115; PBLS2002S T/R; PBLS2002S T/R

NXP Semiconductors
11. Soldering
PBLS2002S_2
Product data sheet
Fig 20. Reflow soldering footprint SOT96-1 (SO8)
Fig 21. Wave soldering footprint SOT96-1 (SO8)
solder lands
occupied area
solder lands
occupied area
0.60 (6 )
placement accurracy
Rev. 02 — 24 August 2009
placement accuracy
solder resist
board direction
1.27 (6 )
0.3 (2 )
5.50
5.50
1.20 (2 )
0.60 (8 )
0.25
0.25
1.27 (6 )
1.30
4.00
1.30
4.00
Dimensions in mm
6.60
Dimensions in mm
enlarged solder land
6.60
7.00
7.00
20 V PNP BISS loadswitch
PBLS2002S
© NXP B.V. 2009. All rights reserved.
sot096-1_fw
sot096-1_fr
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