PMBTA42,215 NXP Semiconductors, PMBTA42,215 Datasheet
PMBTA42,215
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933776090215
PMBTA42 T/R
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PMBTA42,215 Summary of contents
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PMBTA42 300 V, 100 mA NPN high-voltage transistor Rev. 05 — 12 December 2008 1. Product profile 1.1 General description NPN high-voltage transistor in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. PNP complement: PMBTA92. 1.2 Features High voltage ...
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... NXP Semiconductors 3. Ordering information Table 3. Type number PMBTA42 PMBTA42/DG [1] /DG: halogen-free 4. Marking Table 4. Type number PMBTA42 PMBTA42/DG [1] /DG: halogen-free [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. ° amb Symbol I CBO I EBO CEsat V BEsat PMBTA42_5 Product data sheet Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient Characteristics C unless otherwise specified ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 Fig 1. Package outline SOT23 (TO-236AB) PMBTA42_5 Product data sheet 300 V, 100 mA NPN high-voltage transistor scale ...
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... NXP Semiconductors 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PMBTA42 PMBTA42/DG [1] For further information and the availability of packing methods, see [2] /DG: halogen-free 10. Soldering 3 1.7 0.7 (3×) Fig 2. Reflow soldering footprint SOT23 (TO-236AB) ...
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... NXP Semiconductors 1.4 (2×) 4.6 2.6 1.4 Fig 3. Wave soldering footprint SOT23 (TO-236AB) PMBTA42_5 Product data sheet 300 V, 100 mA NPN high-voltage transistor 2.2 1.2 (2×) 2.8 4.5 Rev. 05 — 12 December 2008 PMBTA42 solder lands solder resist occupied area Dimensions in mm preferred transport direction during soldering sot023_fw © ...
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... Release date PMBTA42_5 20081212 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number PMBTA42/DG added • Table 4 “Marking • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 Packing information . . . . . . . . . . . . . . . . . . . . . 5 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...