M38510/21002BJA QP SEMICONDUCTOR, M38510/21002BJA Datasheet - Page 2

• Manufacturer Part Number: M38510/21002BJA
• Manufacturer: QP SEMICONDUCTOR

Specifications of M38510/21002BJA

• Lead Free Status / RoHS Status: Not Compliant

section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of
this specification, whether or not they are listed.
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
DEPARTMENT OF DEFENSE STANDARDS
______
1/ Heat sinking is recommended to reduce the junction temperature.
2/ When a thermal resistance value is included in MIL-STD-1835, it shall supersede the value stated herein.
3/ Must withstand the added P
4/ Maximum junction temperature shall not be exceeded except for allowable short circuit duration burn-in
5/ 16 mA for circuits A, B, D, F, H, and I devices.
1.3 Absolute maximum ratings.
1.4 Recommended operating conditions.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this
screening conditions per method 5004 of MIL-STD-883.
Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc
Input voltage range ................................................................................ -1.5 V dc at -10 mA to +5.5 V dc
Storage temperature range .................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds).............................................. +300°C
Thermal resistance, junction to case (θ
Output voltage range............................................................................... -0.5 V dc to +V
Output sink current.................................................................................. 100 mA
Maximum power dissipation (P
Maximum,unction temperature (T
Supply voltage ....................................................................................... +4.5 V dc minimum to
Minimum high-level input voltage (V
Maximum low-level input voltage (V
Normalized fanout (each output) .......................................................... 8 mA
Case operating temperature range (T
MIL-PRF-38535 -
MIL-STD-883
MIL-STD-1835
Cases J, L, and R.............................................................................. 40°C/W maximum
Case K ............................................................................................. 60°C/W maximum
Case 3 .............................................................................................. 0.08°C/W maximum 2/
-
-
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
Test Method Standard for Microelectronics.
Interface Standard Electronic Component Case Outline
D
due to short circuit test (e.g. I
D
) 3/ ....................................................... 1.02 W
J
) 4/ .................................................... +175°C
IL
IH
) .................................................... 0.8 V dc
) ................................................... 2.0 V dc
C
) .................................................. -55 °C to +125 °C
JC
MIL-M-38510/210E
): 1/
2
OS
).
+5.5 V dc maximum
5/
CC