MT45V512KW16PEGA-70 WT Micron Technology Inc, MT45V512KW16PEGA-70 WT Datasheet - Page 25

• Manufacturer Part Number: MT45V512KW16PEGA-70 WT
• Manufacturer: Micron Technology Inc

Specifications of MT45V512KW16PEGA-70 WT

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Compliant

Package Dimensions
Figure 24:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron Technology, Inc.,
inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of their respective owners. This data
PDF: 09005aef82f264f6/Source: 09005aef82f264aa
8mb_4mb_ap_3v_psram_p22z__2.fm - Rev. C 4/08 EN
sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
Seating
plane
Dimensions apply
to solder balls
post-reflow.
Pre-reflow ball
diameter is 0.35
on a 0.30 SMD
ball pad.
0.10 A
5.25
48X Ø0.37
48-Ball VFBGA
Ball A6
2.625
0.70 ±0.05
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45V512KW16PE uses “green” packaging.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1.875
0.25mm per side.
6.00 ±0.10
0.75
TYP
3.75
C L
3.00 ±0.05
8Mb: 3.0V Core Async/Page PSRAM Memory 512K x 16
0.75 TYP
C L
4.00 ±0.05
Ball A1
times occur.
Ball A1 ID
25
8.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID