MCIMX31LCVMN4D Freescale, MCIMX31LCVMN4D Datasheet - Page 11

• Manufacturer Part Number: MCIMX31LCVMN4D
• Manufacturer: Freescale

Specifications of MCIMX31LCVMN4D

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Freescale Semiconductor
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case (Top)
Junction to Package Top (natural convection)
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
2. Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6.
3. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board
4. Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The
5. Thermal characterization parameter indicating the temperature difference between the package
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
Thermal test board meets JEDEC specification for this package.
meets JEDEC specification for the specified package.
cold plate temperature is used for the case temperature. Reported value includes the thermal
resistance of the interface layer.
top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
Rating
Table 6. Thermal Resistance Data—19
MCIMX31C/MCIMX31LC Technical Data, Rev. 4.3
Four layer board (2s2p)
NOTES
Board
—
—
—
×
19 mm Package (continued)
Symbol
R
R
R
θJCtop
Ψ
θJMA
θJB
JT
Value
25
19
10
2
Electrical Characteristics
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2, 3
1, 3
1, 4
1, 5
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